Laser Interconnection of Copper Particle Patterning Layers
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Solution Overview
Problem
Conventional methods for forming electroconductive copper patterning layers require high-temperature inert gas processes, which are industrially challenging, and result in poor conductivity when performed in atmospheric conditions due to copper oxidation.
Innovation Solution
A method involving the preparation of a dispersion solution of copper-based particles, followed by printing or filling on a substrate, and subsequent laser irradiation to interconnect the particles, forming a conductive copper patterning layer without the need for inert gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature thermal treatment under inert gas is used to form copper patterning layer, then electric conductivity is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The invention extracts and removes the inert gas environment requirement from the thermal treatment process. By using laser irradiation instead of conventional thermal treatment, the process can be performed directly in atmospheric conditions, eliminating the need for complex inert gas handling systems while maintaining copper particle interconnection and conductivity formation
Solution Approach 2:
The invention replaces the conventional thermal field-based heating system with a laser-based energy system. The laser provides localized, rapid energy input that directly melts and sinteres the copper particles without requiring bulk thermal treatment or inert gas protection, thereby simplifying the overall process equipment and manufacturing complexity
2Ease of manufacture
If burning process is performed under atmospheric circumstance, then ease of manufacture is improved, but electric conductivity deteriorates due to copper oxidation
Solution Approach 1:
The invention uses laser irradiation to rapidly melt and sinter the copper particles in a very short time period. This rapid processing skips the prolonged exposure to atmospheric oxygen that would cause oxidation, allowing the process to be performed in atmospheric conditions while maintaining high conductivity by minimizing the time window for oxidation to occur
Solution Approach 2:
The laser irradiation method performs the copper particle interconnection action before significant oxidation can occur. The rapid localized heating and melting happens so quickly that the copper particles are fused together in the initial stage, forming conductive pathways before atmospheric oxygen can extensively oxidize the copper surface
3Reliability
If conventional thermal treatment is used, then copper particles are interconnected, but processing time is excessive and productivity is reduced
Solution Approach 1:
The invention replaces conventional thermal field heating with laser irradiation, which provides highly concentrated and localized energy input. This allows rapid melting and sintering of copper particles in a matter of seconds or less, compared to the prolonged thermal treatment required by conventional methods, thereby dramatically increasing processing speed and productivity while ensuring complete particle interconnection
Solution Approach 2:
The laser irradiation method applies energy locally and selectively to the copper particle patterning layer rather than heating the entire substrate uniformly. This localized energy concentration enables rapid and efficient melting and sintering of only the required copper particles, reducing overall processing time and improving productivity while maintaining reliable particle interconnection in the targeted areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of copper patterning layers with excellent electric conductivity even in atmospheric conditions by quickly burning the copper-based particle layer using laser irradiation, minimizing oxidation and ensuring high conductivity.
Implementation Method 1
irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper-based particle patterning layer
Implementation Method 2
burning a copper-based particle patterning layer within a short time
Implementation Method 3
copper oxides are reduced into copper and thus connected with each other
Data Source
AI summary
A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper-based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed.