Laser Cutting Substrate Thickness Variation for Display Devices
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Solution Overview
Problem
Current display device manufacturing processes face challenges in reducing defect rates and manufacturing time, particularly due to short circuits between wiring lines caused by conductive carbide ash generation during laser cutting, which affects efficiency and quality.
Innovation Solution
The method involves using a laser beam with low output power for cutting substrates to minimize short circuits and then employing a higher intensity laser beam for cutting the remaining substrate, with distinct cut surfaces and slopes to prevent ash formation and enhance efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a high intensity laser beam is used for cutting the substrate, then the cutting speed and productivity are improved, but conductive carbide ash is generated causing short circuits between wiring lines
Solution Approach 1:
The cutting process is divided into two distinct stages: first, a low intensity laser beam removes conductive carbide ash and prevents short circuits; second, a high intensity laser beam performs the actual substrate cutting. This segmentation allows each stage to optimize for its specific function without compromising the other.
Solution Approach 2:
The low intensity laser beam performs a preliminary cleaning action by removing conductive carbide ash from the substrate surface before the high intensity laser beam performs the main cutting operation. This preliminary action prevents defects that would otherwise be caused by the high intensity cutting process.
2Reliability
If a low output power laser beam is used for cutting, then conductive carbide ash generation is reduced, but the manufacturing time increases
Solution Approach 1:
The manufacturing process is segmented into two phases: a first cutting process using low output power laser to minimize ash generation and defects, followed by a second cutting process using high intensity laser to complete the substrate cutting efficiently. This segmentation balances quality and speed requirements.
Solution Approach 2:
The dual-stage cutting process ensures continuous productive action: the first stage prepares the substrate by removing harmful ash, and the second stage immediately follows to complete the cutting. This continuous process minimizes total manufacturing time while maintaining low defect rates.
3Strength
If the first protective substrate thickness is increased in the first sub-region, then the structural strength is improved, but the manufacturing complexity increases
Solution Approach 1:
The first protective substrate is designed with non-uniform thickness, having a first sub-region with greater thickness for enhanced strength where needed, and a second sub-region with reduced thickness to minimize complexity. This local quality variation allows the substrate to meet strength requirements only in critical areas.
Solution Approach 2:
The substrate thickness distribution is made asymmetric, with the first sub-region positioned at a specific location having greater thickness than the second sub-region. This asymmetric design optimizes structural strength where required while reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a display device with a lower defect rate and reduced manufacturing time, improving overall manufacturing efficiency by preventing conductive carbide ash generation and optimizing the cutting process.
Implementation Method 1
cutting the second substrate and a part of the first substrate by a first laser beam irradiating process
Implementation Method 2
cutting off the remaining first substrate by a second laser beam irradiating process
Data Source
AI summary
A display device includes a display panel and a first protective substrate positioned under the display panel and including a first sub-region and a second sub-region positioned at a side of the first sub-region. A thickness of the first protective substrate in the first sub-region is greater than a thickness of the first protective substrate in the second sub-region.