Laser-Induced Detachment Zones for Precision Solid Layer Splitting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for separating solid portions, such as sawing, result in material waste, surface damage, and high costs due to the production of chips and thermal stress, which limits the processing of thick and large solids.
Innovation Solution
A method using laser radiation to create a detachment zone within a solid by penetrating the laser beams into the solid via a surface of the portion to be cut, inducing material conversion and crystal lattice modifications that weaken the material without local destruction, allowing for precise separation of solid layers without shortening the solid orthogonally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sawing is used to separate solid portions, then separation is achieved, but chips are produced forming disturbed base material and surface damage occurs
Solution Approach 1:
The patent replaces the mechanical sawing system with a laser-based system. Laser beams are used to induce material conversion and create detachment zones through optical energy, eliminating mechanical contact that causes chips and surface damage. The laser radiation transforms the material in a controlled manner without physical cutting tools.
Solution Approach 2:
The patent changes the physical state and properties of material through laser-induced temperature changes. By controlling laser parameters (energy density, pulse duration, wavelength), the material undergoes phase transitions and structural modifications that create separation zones without mechanical removal, thus preventing surface damage and chip formation.
2Manufacturing precision
If sawing is used to separate solid portions, then separation is achieved, but thickness fluctuation increases with increasing sawing height
Solution Approach 1:
The laser-based system replaces mechanical sawing, allowing precise control of energy deposition at any depth without the thickness fluctuations that occur with mechanical blades. The laser can maintain consistent energy density throughout the separation process regardless of depth, ensuring uniform thickness.
Solution Approach 2:
The patent employs pulsed laser radiation with controlled repetition rates. This periodic action allows for precise control of heat accumulation and material transformation, maintaining consistent separation quality at varying depths by adjusting pulse parameters rather than relying on continuous mechanical contact.
3Productivity
If laser irradiation is used to separate device layers, then separation is achieved, but very strong heating occurs requiring high thermal stressability
Solution Approach 1:
The patent applies laser radiation locally to specific detachment zones rather than uniformly heating the entire solid. By focusing energy only where separation is needed and controlling the spatial distribution of laser beams, intense heating is localized to minimal regions, reducing overall thermal stress requirements.
Solution Approach 2:
The patent utilizes controlled phase transitions of materials at localized detachment zones through laser heating. By inducing phase changes (melting, vaporization, or structural transformation) only at specific locations, separation is achieved without requiring the entire solid to undergo thermal stress, thereby reducing overall heating intensity.
4Manufacturing precision
If laser beams are introduced via surface into the solid, then separation is achieved, but severe heating of the solid occurs causing distortion
Solution Approach 1:
The patent introduces laser beams through strategically selected surfaces and focuses energy locally at predetermined detachment zones. By controlling the entry points and focal positions of laser beams, heating is confined to specific regions where separation is needed, preventing overall solid distortion while maintaining precise separation.
Solution Approach 2:
The patent pre-defines detachment zones and plans laser beam paths before processing. By calculating optimal entry surfaces and focal positions in advance, the laser radiation is directed to create separation without causing unintended heating or distortion of the solid, ensuring precision while minimizing shape changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables controlled material conversion and phase changes, reducing material strength and allowing for precise separation of solid layers with minimal residual damage and thermal stress, enabling the processing of larger and thicker solids.
Implementation Method 1
subjecting the solid to laser radiation from the laser light source, wherein the laser beams penetrate into the solid via a surface of the solid portion to be cut off
Implementation Method 2
the temperature produced in the predefined portion of the solid is so high that the material forming the predefined portion undergoes modification in the form of a predetermined material conversion
Implementation Method 3
a plurality of modifications in the crystal lattice are successively produced by the applied laser radiation, wherein as a result of the modifications in the regions surrounding the modifications, the crystal lattice fissures at least in a portion thereof
Data Source
AI summary
The invention relates to a method for creating a detachment zone in a solid in order to detach a solid portion, especially a solid layer, from the solid, said solid portion that is to be detached being thinner than the solid from which the solid portion has been removed. According to the invention, the method comprises at least the steps of: providing a solid which is to be processed and which is preferably made of a chemical compound; providing a LASER light source; subjecting the solid to LASER radiation from the LASER light source so that the laser beams penetrate into the solid via a surface of the solid portion that is to be cut off; the LASER radiation is applied in a defined manner to a predefined portion of the solid inside the solid such that a detachment zone or a plurality of partial detachment zones is formed; the method is characterized in that a number of modifications is successively created in the crystal lattice by the applied laser radiation, and the crystal lattice fissures at least partially in the regions surrounding the modifications as a result of the modification, said fissures in the region of the modifications predefining the detachment zone or a plurality of partial detachment zones.