Laser Diode Heat Sink Mount with Threaded Compression
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Solution Overview
Problem
Conventional heat sink mounts for laser diodes often fail to provide efficient heat dissipation due to suboptimal contact surfaces and the use of glues that may compromise heat transfer or release toxic substances, leading to premature failure and increased manufacturing costs.
Innovation Solution
A heat sink mount with a simple, three-component design featuring a stadium-shaped inner surface to match the laser diode's stem section and using threads for assembly without screws or glue, minimizing air pockets and allowing easy disassembly for component replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat sink mounts use glue to attach laser diodes, then assembly is simplified, but heat transfer efficiency deteriorates and toxic substances may be released
Solution Approach 1:
The invention removes the glue layer from the heat sink mount structure, extracting the harmful intermediary substance that blocked heat transfer. The laser diode is attached directly to the heat dissipation surface through mechanical pressure alone, eliminating the thermal barrier and toxic substance source while maintaining assembly simplicity through the compression fitting mechanism.
Solution Approach 2:
The invention introduces a conductive adhesive pad as an optional intermediary layer that serves dual purposes: it provides electrical isolation when needed while maintaining excellent thermal conductivity. This mediator replaces the conventional non-conductive glue, allowing heat transfer to proceed efficiently while providing functional benefits.
2Strength
If conventional heat sink mounts use screws to secure components, then mechanical strength is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The invention merges the fastening function into the heat sink mount body itself by incorporating an elastic compression structure. The elastic portion of the mount acts as both the heat dissipation pathway and the mechanical fastening element, eliminating the need for separate screws or clips and reducing overall device complexity while maintaining secure attachment.
Solution Approach 2:
The invention changes the mechanical parameter from rigid screw fastening to elastic compression fastening. By using an elastic material with appropriate modulus and geometry, the mount provides continuous pressure to secure the laser diode without requiring threaded holes or additional fasteners, simplifying the structure while maintaining adequate mechanical strength.
3Temperature
If conventional heat sink mounts have large contact surfaces, then heat dissipation is improved, but air pockets increase reducing contact efficiency
Solution Approach 1:
The invention applies local quality by concentrating the contact interface at a specific optimized location and geometry. Rather than attempting to maximize overall contact area, the elastic compression structure creates a localized high-pressure contact zone that ensures intimate thermal contact between the laser diode and heat sink, compensating for surface imperfections through localized deformation.
Solution Approach 2:
The invention employs curved or rounded contact surfaces in the elastic portion of the mount, allowing conformal contact with the laser diode stem. The elastic material deforms to match the contour of the contact surface, eliminating air pockets and ensuring maximum thermal contact efficiency without requiring extremely precise flat surface manufacturing.
4Ease of manufacture
If conventional heat sink mounts use toxic glue, then assembly cost is reduced, but environmental sustainability and safety deteriorate
Solution Approach 1:
The invention extracts and eliminates the toxic glue substance from the assembly process. By using a mechanical compression fitting with an elastic component, the mount secures the laser diode without any chemical adhesives, thereby removing the source of toxic substance release while maintaining ease of manufacture through simple assembly operations.
Solution Approach 2:
The elastic portion of the heat sink mount is designed as a simple, inexpensive component that can be easily replaced if needed. This disposable-like approach eliminates the need for expensive toxic-free adhesive chemicals while maintaining safety and environmental sustainability, as the elastic material itself serves the bonding function without introducing harmful substances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, reduces manufacturing costs, and allows for the use of different laser diodes from various manufacturers, promoting environmental sustainability by minimizing waste and ensuring safe operation across various applications.
Implementation Method 1
a heat sink is the key for a laser diode's properly functioning and its reliability... efficiently transfer such heat to outside
Data Source
AI summary
A heat sink mount for a laser diode comprises three main components, a diode ring, a diode bed and a diode container. The diode ring comprises an inner hole that matches a metal stem part of the laser diode. The diode bed comprises a first part and a second part. The diode ring is fitted into the first part of the diode bed. The inner surface of the first part is tightly contacting the outer surface of the diode ring. The diode container comprises a part a and a part b. The diode bed is fitted into the part a of the diode container, via the gripping contact between the thread on the inner surface of the part a and the thread on the outer surface of the second part of diode bed. This heat sink mount has lower costs and higher heat dissipation efficiency.