Semiconductor Laser Structural Details TRIZ Cases
- Laser Component Oxygen Plasma Bonding for Thermal Management
Oxygen plasma pre-treatment prevents colored layer formation at oxide laser interfaces, ensuring optical transparency and low thermal resistance.
- Wavelength Conversion Member With Ceramic Particles For Heat Dissipation
A wavelength conversion member uses easily sinterable ceramic particles to bind inorganic phosphors and conduct heat away from the active layer.
- High-Index Spot-Size Converter for Waveguide Coupling
A spot-size converter uses high-index elements to enable evanescent coupling between dissimilar waveguides.
- Porous Oxide Wavelength Conversion Member Heat Dissipation
A wavelength conversion member uses a porous oxide matrix to conduct heat away from phosphor particles.
- Self-aligning Semiconductor Laser Assembly with Integrated Heat Exchanger
A self-aligning semiconductor laser assembly integrates a heat exchanger and carrier to position optical components during packaging.
- Semiconductor Light Emitting Device Cap with Inclined Opening
An inclined cap opening minimizes return light reflection onto the semiconductor element, increasing light emission intensity and extending lifespan.
- Piezoelectric Tuned Laser Flex Bearing Pivot
A flex bearing mediates piezoelectric motion to define a precise pivot axis, eliminating mode hops and enabling stable wavelength tuning in vacuum environments.
- Semiconductor Laser Cleavage via Preliminary Laser Scribing
Preliminary laser scribing creates internal modified regions along cutting lines, eliminating secondary scribing steps and boosting manufacturing productivity.
- Stacked Waveguide Optical Coupler for Silicon Photonics
A stacked waveguide optical coupler uses evanescent coupling between adjacent layers to adapt light fields.
- Monolithic CMOS-Photonics Integration via Segmented Fabrication
Segmented fabrication lines produce monolithic silicon structures combining waveguides and CMOS components.
- Low-Temperature Hermetic Sealing for Optoelectronic Housing Covers
A housing cover production method uses eutectic solder metallization to join glass components at low temperatures.
- Low SWAP Laser Diode Pump Module with Fluid Cooling
Fluid coolant flow channels in laser diode pump modules reduce system weight and power consumption while maintaining steady-state temperature.
- Multi-segment Focusing Lens for Laser Wafer Dicing
A multi-segment focusing lens concentrates pulsed laser energy into multiple focal points within semiconductor wafers.
- {110} Facet Epitaxial Growth for Vertical Mirror Surfaces
Epitaxial growth of {110} sidewalls on patterned substrates creates vertical mirror facets.
- Laser Diode Heat Sink Mount with Threaded Compression
Threaded compression secures a laser diode in a heat sink mount, eliminating toxic adhesives and improving thermal conduction.
- Optical Sensor Diffuser for Laser Safety and S/N Ratio
A diffusing member refracts laser light to enlarge the beam diameter and apparent source size.
- Substrate-Side VCSEL Emission via Open Region and AR Coating
An open region exposes the first DBR for substrate-side emission, enabling operation at 850 nm and 1550 nm while reducing substrate resistance in the circuit.