Self-aligning Semiconductor Laser Assembly with Integrated Heat Exchanger
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High power lasers for consumer and non-traditional markets require precise optical alignment and focus, which increases production costs and complexity, making them unsuitable for mass production and consumer use.
Innovation Solution
A self-assembling laser system with simple parts that can be assembled in few motions, featuring a heat exchanger and carrier configuration for efficient heat dissipation and optical alignment, allowing for 'plug and play' operation without post-fabrication adjustments, using a fan for heat removal and a housing system with a pressure sensor for safety and emission control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If precise optical alignment and focus are implemented for high power lasers, then laser performance and precision are improved, but production cost and device complexity increase
Solution Approach 1:
The patent implements self-aligning features where the laser diode chip and optical components automatically position themselves during assembly through mechanical guides and precision-machined surfaces. The housing includes built-in alignment features that ensure correct optical alignment without requiring manual adjustment or complex alignment procedures, allowing the system to self-correct and self-position components during assembly
Solution Approach 2:
The patent pre-configures alignment features and precision-machined surfaces during the manufacturing process. The housing and mounting structures are pre-formed with precise geometric features that guide component placement and ensure correct optical alignment before final assembly, eliminating the need for post-assembly alignment adjustments
2Manufacturing precision
If precise optical alignment and focus are implemented for high power lasers, then laser performance is improved, but production cost increases
Solution Approach 1:
The self-aligning features and built-in mechanical guides enable automated assembly processes, reducing or eliminating the need for skilled manual alignment work. This reduces labor costs and allows for high-volume production while maintaining precise optical alignment, thereby lowering per-unit production costs
Solution Approach 2:
By pre-configuring precision alignment features during manufacturing rather than requiring post-assembly adjustment, the patent reduces assembly time and labor requirements. This preliminary preparation of alignment features enables faster, more consistent assembly processes that reduce overall production costs
3Reliability
If heat dissipation improvements are implemented for high power lasers, then laser reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat sink structure with the housing into a single integrated component. The housing itself is designed to serve as the thermal management structure, with heat dissipation features built directly into the housing geometry. This merging of structural and thermal management functions improves reliability through effective heat dissipation while avoiding the added complexity of separate thermal management components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of high-powered, multi-Watt laser systems suitable for mass-market applications, such as medical and forensic uses, with reduced production costs and complexity, ensuring efficient heat management and precise alignment without manual labor, while ensuring eye safety and controlled emission.
Implementation Method 1
a heat exchanger in contact with the carrier
Implementation Method 2
using a fan for heat removal
Implementation Method 3
lens mounted on the heat exchange and over the bore
Implementation Method 4
a housing system with a pressure sensor for safety and emission control
Data Source
AI summary
A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system, such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses. Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system is self-aligned and focused by the assembly process without requiting post-assembly adjustment. This system can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items.