Laser Diode Heat Dissipation via Submount Bonding
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Solution Overview
Problem
Semiconductor lasers face challenges in heat dissipation due to increasing output, which affects their performance and efficiency.
Innovation Solution
A method of manufacturing a light emitting device involves bonding a wafer with a conductive first substrate and a laser element structure to a second substrate, reducing the thickness of the first substrate, and mounting the laser element on a submount such that the lower surface electrode faces the submount, thereby improving heat dissipation by positioning the heat source closer to the submount and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the output of a semiconductor laser is increased, then the power increases, but the heat generation increases
Solution Approach 1:
The patent extracts the heat dissipation function by bonding the laser element directly to the submount, separating the heat generation source from the optical output path and directing heat flow through the submount for efficient dissipation
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional heat management by bonding the laser element to the submount, creating a vertical heat conduction path that reduces thermal resistance and improves heat dissipation efficiency
2Temperature
If the thickness of the first substrate is reduced, then the heat dissipation performance improves, but the mechanical strength decreases
Solution Approach 1:
The patent merges the first substrate with the submount through bonding, creating a composite structure where the thin first substrate provides thermal pathways while the thicker submount provides mechanical support, resolving the contradiction between heat dissipation and strength
Solution Approach 2:
The patent creates a composite structure by bonding the first substrate to the submount, combining materials with different thermal and mechanical properties to achieve both excellent heat dissipation and sufficient mechanical strength in the final assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation performance and reduces thermal resistance, leading to improved efficiency and reduced driving voltage of the laser element.
Implementation Method 1
bonding the wafer to a second substrate at an upper surface electrode side of the wafer
Data Source
AI summary
A method of manufacturing a light emitting device includes: providing a wafer including a conductive first substrate, a laser element structure on an upper side of the first substrate, and an upper surface electrode on an upper surface of the element structure; bonding the wafer to a second substrate at an upper surface electrode side of the wafer; removing a portion of the first substrate to reduce a thickness of the wafer; forming a lower surface electrode on a lower surface of the first substrate at which the removing of the portion of the first substrate has been performed; singulating the wafer to obtain a laser element; and mounting the laser element on a submount such that the lower surface electrode faces the submount.