Laser-Released Display Substrate for Narrow-Bezel Tiled Panels

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Solution Overview

Problem

Tiled display devices face issues with bezel visibility, which deteriorates display quality, and existing manufacturing methods are costly and prone to damage due to the need for protective glass and static electricity.

Innovation Solution

A method of manufacturing a display device involving a sacrificial layer with high absorption rate and low melting point, allowing laser separation without protective glass, reducing bezel visibility and manufacturing costs, and minimizing damage risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If protective glass is used during manufacturing, then manufacturing precision is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improvemanufacturing precisionVSAvoiddevice complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The sacrificial layer is formed beforehand on the carrier glass before the substrate layers are deposited. This preliminary action allows the sacrificial layer to serve as a protective interface during manufacturing, eliminating the need for separate protective glass while maintaining manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The sacrificial layer acts as an intermediary between the carrier glass and the substrate layers. It provides the necessary protection and interface during manufacturing processes, then can be selectively removed via laser irradiation, replacing the function of protective glass without adding device complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If protective glass is used during manufacturing, then manufacturing precision is improved, but manufacturing cost increases

Engineering Contradiction:
Improvemanufacturing precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The sacrificial layer is designed as a disposable, low-cost material that performs its protective function temporarily during manufacturing, then is removed by laser irradiation. This replaces expensive protective glass with a cheap, consumable material, reducing overall manufacturing cost while maintaining precision.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The sacrificial layer materials (titanium, molybdenum, or molybdenum oxide) are selected based on their specific physical parameters - high laser absorption rate and relatively low melting point. These parameter changes enable selective removal by laser irradiation, providing a cost-effective alternative to protective glass.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If conventional manufacturing methods are used, then display quality is maintained, but bezel visibility increases

Engineering Contradiction:
Improvedisplay qualityVSAvoidbezel area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The sacrificial layer is selectively removed from specific regions via laser irradiation, extracting material only where needed. This allows for reduced bezel areas and optimized display boundaries while maintaining the structural integrity and display quality of the remaining substrate layers.

Inventive Principle:
Principle #2Taking out (Extraction)

4Productivity

If laser irradiation is used to separate sacrificial layer, then manufacturing time is reduced, but energy consumption increases

Engineering Contradiction:
Improvemanufacturing timeVSAvoidenergy consumption
Core Design Contradiction:
ProductivityVSUse of energy by stationary object

Solution Approach 1:

The sacrificial layer materials are specifically selected for their high laser absorption rates and relatively low melting points. These parameter changes enable efficient laser irradiation processing, where the laser energy is rapidly absorbed and converted to thermal energy, melting and removing the sacrificial layer quickly. This optimizes the balance between manufacturing time and energy consumption.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method decreases bezel-related quality issues and manufacturing costs, while preventing damage from static electricity, resulting in a more efficient and cost-effective display device production.

Implementation Method 1

an absorption rate of the sacrificial layer with respect to the laser may be about 25% or more

Methodology Applied
Scientific EffectLaser absorption: Absorption (EM radiation)

Implementation Method 2

a melting point of the sacrificial layer may be about 3,000 degrees Celsius or less

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentUS12170269B2Display device and method of manufacturing display device
Publication Date: 2024.12.17 SAMSUNG DISPLAY CO LTD
  • US12170269B2 patent drawing
  • US12170269B2 patent drawing
  • US12170269B2 patent drawing

AI summary

A display device and a method of manufacturing a display device are provided. A method of manufacturing a display device may include: forming a sacrificial layer on a carrier glass; forming a first substrate layer on the sacrificial layer, the first substrate layer including an organic insulation material; forming a first through-hole in the first substrate layer, the first through-hole passing through the first substrate layer; forming a wiring on an upper surface of the first substrate layer, the wiring extending into the first through-hole; sequentially forming a circuit layer, an emission layer, and an encapsulation layer on the wiring; separating the sacrificial layer and the carrier glass from the first substrate layer by irradiating the sacrificial layer with a laser; and attaching a driving element on a lower surface of the first substrate layer, the driving element being electrically connected to the wiring through the first through-hole.