Laser-Assisted End Effector Vision for Warped Wafer Clearance
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Solution Overview
Problem
The handling of warped or thicker semiconductor wafers is challenging due to uncertainties in warpage magnitude, making it difficult to extend or retract robot end effectors without collision or drag out, particularly in heterogeneous integration scenarios.
Innovation Solution
Incorporating a first laser diode to emit laser light and a camera to sense reflected light, with a processor determining clearance height and vibration amplitude between the end effector and the object, enabling precise control of the robot arm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the robot end effector is extended or retracted between two wafers, then the handling capability for warped wafers is improved, but collision or drag out may occur due to uncertainty in warpage magnitude
Solution Approach 1:
The system performs preliminary measurement of the wafer's warpage magnitude and characteristics before the end effector extends or retracts. The laser device measures the warpage, and the controller uses this advance information to determine safe extension/retraction distances, preventing collision before it occurs
Solution Approach 2:
The system continuously monitors wafer position and end effector movement, using real-time feedback from the laser measurement system to adjust the end effector's extension and retraction actions dynamically, ensuring collision-free operation despite warpage variations
2Ease of manufacture
If the end effector is designed with fixed structure, then manufacturing is simplified, but it cannot adapt to different warpage magnitudes and wafer thicknesses
Solution Approach 1:
The end effector incorporates movable or adjustable components that can dynamically change their position or configuration based on real-time measurements of wafer warpage and thickness, allowing the same structure to adapt to different handling requirements without complex redesign
Solution Approach 2:
The system changes operational parameters such as end effector extension distance, approach speed, and contact force based on measured wafer properties including warpage magnitude and thickness, enabling a fixed structure to handle variable conditions through parameter adjustment
3Device complexity
If traditional vision systems are used without laser assist, then device complexity is reduced, but measurement precision for clearance height and vibration detection is insufficient
Solution Approach 1:
The system merges traditional vision sensing with laser measurement technology into an integrated sensing system. The laser provides precise distance and vibration measurements while the camera captures visual information, combining both modalities to achieve high measurement precision without excessive complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables safe and precise handling of warped wafers by accurately determining clearance height and vibration amplitude, preventing collisions and ensuring smooth movement of the end effector.
Implementation Method 1
a camera configured to sense or detect first reflected light from an object upon which the first laser light contacts
Data Source
AI summary
A robot including a robot arm having an end effector and a first laser diode provided on the end effector. The first laser diode is configured to emit a first laser light in a first direction. The robot further includes a camera configured to sense or detect first reflected light from an object upon which the first laser light contacts, and a processor configured to determine a clearance height between the end effector and the object using information from the first reflected light.