Laser Cutting Head Return Path for Wavy Plate Edge Avoidance
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Solution Overview
Problem
In laser processing methods, the laser irradiation unit risks colliding with the edge of a plate material due to waviness, especially when moving back from the outer part to the cutting position, leading to potential collisions and inefficiencies in cutting.
Innovation Solution
A method involving a plate material end portion holding process to maintain the end portion of the plate material at a predetermined position, using a combination of first and second workpiece holding tools with different clearances to prevent collisions and ensure accurate positioning, allowing the laser irradiation unit to move safely and cut the material effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the laser irradiation unit moves to the outer part of the portion just above the plate material in the width direction, then the laser processing can be performed, but the laser irradiation unit risks colliding with the edge of the plate material due to waviness when returning to the cutting position
Solution Approach 1:
A workpiece holding tool is introduced as an intermediary device between the laser irradiation unit and the plate material. This holding tool contacts the plate material to suppress waviness, enabling the laser irradiation unit to move to the outer part for processing while preventing collision with the material edge during return movement.
2Reliability
If the laser irradiation unit remains just above the plate material throughout processing, then collision risk is reduced, but the laser processing efficiency and versatility are limited
Solution Approach 1:
The workpiece holding tool serves as a mediator that allows the laser irradiation unit to operate in the outer position. The holding tool suppresses plate material waviness while the laser unit performs processing from the outer position, achieving both collision prevention and improved processing efficiency.
Solution Approach 2:
The system is divided into two functional components: the workpiece holding tool responsible for stabilizing the plate material by suppressing waviness, and the laser irradiation unit responsible for processing. This segmentation allows each component to perform its specific function optimally.
3Device complexity
If a single workpiece holding tool is used, then the device complexity is reduced, but the manufacturing precision and control over plate material position are insufficient
Solution Approach 1:
The workpiece holding function is segmented into multiple holding tools positioned at different locations. The first holding tool contacts the plate material at one position while the second holding tool contacts at another position, providing superior control over plate material position and suppressing waviness more effectively than a single tool.
Solution Approach 2:
Different holding tools are positioned at different locations on the plate material, with each tool providing localized support. The first holding tool and second holding tool contact the plate material at different positions, allowing precise control of the plate material shape and position throughout the processing area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents collisions between the laser irradiation unit and the plate material's edge, ensuring precise cutting and reducing friction by maintaining accurate distance and contact points, thereby enhancing the laser processing efficiency.
Implementation Method 1
a laser irradiation unit (30) that irradiates the plate material P with a laser beam
Implementation Method 2
cutting a plate material (for example, a plate material P to be described later) by laser irradiation
Data Source
AI summary
Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.