Laser Cutting and Vacuum Holding for Flexible Foil Cut Pieces
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Solution Overview
Problem
The handling, fastening, and processing of flexible, thin flat materials in the electronics industry, particularly for producing cut pieces from anode and cathode foils, are complex due to their flexibility and thinness, leading to issues with distortion and waste management.
Innovation Solution
A processing device equipped with a holding device for suctioning and clamping the flat material, a laser cutting system for precise cutting without mechanical load, and a transport system for handling cut pieces and waste, ensuring secure and reproducible cutting and positioning of cut pieces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical cutting methods (sawing, punching) are used on flat material, then cutting can be performed, but mechanical load and distortion occur on the flexible thin material
Solution Approach 1:
The patent replaces mechanical cutting methods (sawing, punching) with laser cutting technology. The laser beam cuts the flat material through thermal energy rather than mechanical force, eliminating mechanical load and associated distortion on the flexible thin material while maintaining effective cutting capability
2Stability of the object's composition
If clamping force is increased to prevent distortion of flexible flat material, then positioning stability improves, but material damage or deformation increases
Solution Approach 1:
The clamping device is divided into multiple independent clamping elements that can be distributed across the flat material. This segmentation allows uniform distribution of clamping force, providing sufficient positioning stability without concentrating excessive force on any single point that could damage the flexible material
Solution Approach 2:
The clamping force is applied locally at specific points along the edges of the flat material rather than uniformly across the entire surface. This localized clamping provides adequate positioning stability while minimizing overall impact on material integrity
3Stability of the object's composition
If laser cutting is used to avoid mechanical load, then material distortion decreases, but thermal load and energy consumption increase
Solution Approach 1:
The laser beam is applied partially only to the specific cutting paths required rather than treating the entire material surface. This selective application achieves the necessary cutting precision with minimal thermal input and reduced energy consumption compared to treating the whole material area
4Stability of the object's composition
If the flat material is held by suction during cutting, then positioning stability improves, but cutting precision may be compromised due to material deformation from suction force
Solution Approach 1:
The suction holding device uses multiple distributed suction points rather than a single large suction area. This segmentation allows secure positioning of the flat material while minimizing localized deformation at each suction point, thereby maintaining cutting precision
Solution Approach 2:
Suction force is applied locally at discrete points along the material edges rather than uniformly across the entire surface. This localized approach provides sufficient positioning stability while minimizing overall material deformation that could affect cutting precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable, precise, and efficient cutting of flat materials into cut pieces with minimal distortion and waste management, facilitating their use in electronic applications.
Implementation Method 1
The holding device is preferably designed as a vacuum holding device for suctioning the flat material
Implementation Method 2
The nozzles are arranged such that the nozzles suction the flat material and in particular the cut pieces
Implementation Method 3
a laser beam emitted by the laser device is directed onto the flat material and an energy input into the flat material occurs at an impingement point
Implementation Method 4
the flat material is cut at the impingement point
Implementation Method 5
The clamping is intended to build up an internal tension, which extends in the material plane, within the flat material, wherein the clamping should counteract the flexible design of the flat material
Data Source
AI summary
A processing device (10) for processing flat material (12) extending along a material plane (11) includes at least one holding device (200) for holding the flat material (12), at least one clamping device (400) for fastening the flat material (12) in place and for clamping the flat material (12) along the material plane (11), and at least one laser device (600) for cutting at least one cut piece (1) from the flat material (12). The holding device (200) is designed such that the at least one cut piece (1) is held by the holding device (200) after the laser cut.