Laser Laminate Cutting with Heat Control to Prevent Inter-Layer Peeling
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Solution Overview
Problem
Laser processing of composite materials with laminated layers faces inter-layer peeling due to thermal expansion coefficient differences, leading to structural integrity issues.
Innovation Solution
A laser processing method and device that irradiate the base material with specific heat input conditions and cooling mechanisms to control thermal expansion, cutting the layers under different conditions to minimize inter-layer peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-power laser beam is used for cutting processing, then productivity is improved, but inter-layer peeling occurs due to heat input
Solution Approach 1:
The patent divides the cutting process into multiple passes with different laser power levels. The first pass uses reduced power to cut through the laminate without excessive heat, and subsequent passes complete the cut at higher power. This segmentation of the cutting operation allows productivity to be maintained while preventing inter-layer peeling during the critical initial cutting phase.
Solution Approach 2:
The patent dynamically changes laser processing parameters (power, speed, focus position) based on the cutting depth and layer being processed. By adjusting these parameters in real-time, the system maintains high productivity while controlling heat input to prevent peeling at critical interfaces between layers with different thermal expansion coefficients.
2Manufacturing precision
If laser processing is performed on laminated composite material, then cutting capability is improved, but inter-layer peeling occurs due to thermal expansion coefficient difference
Solution Approach 1:
The patent performs preliminary cutting at reduced laser power to create an initial cut path through the laminate structure. This preliminary action establishes the cutting trajectory and reduces the overall material thickness, allowing subsequent high-power passes to complete the cut with minimal risk of inducing inter-layer peeling from excessive heat accumulation.
Solution Approach 2:
The patent employs periodic oscillation of the laser beam or workpiece during cutting processing. This periodic action distributes heat input more evenly across the cutting zone, preventing localized overheating that would cause thermal expansion differences and inter-layer peeling, while maintaining effective cutting capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses inter-layer peeling during laser processing of composite materials with varying thermal expansion coefficients, allowing for precise cutting while maintaining structural integrity.
Implementation Method 1
cutting processing of cutting a base material, which includes a first layer and a second layer laminated on one surface of the first layer, by irradiating the base material with laser light
Implementation Method 2
supplying a cooling medium to the second layer to cool the second layer
Implementation Method 3
cutting the second layer by irradiating the second layer with the laser light
Data Source
AI summary
A laser processing method for cutting a base material, including stacked first and second layers having different thermal expansion coefficients, includes radiating laser light onto a first inter-layer part under prescribed first inter-layer conditions, to cut the first inter-layer part, which extends from a position in the vicinity of a layer boundary inward of the surface of the second layer, through the layer boundary between the second layer and the first layer, to a position in the vicinity of a layer boundary inward of said one surface of the first layer, and radiating the laser light onto a part of the first layer inward from the position in the vicinity of the layer boundary, under first conditions, to cut the first layer, wherein the first inter-layer condition is a condition under which the amount of heat input by the laser light is less than under the first condition.