Semiconductor Laser Light Emission Device Without Lead Terminals
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emission devices using semiconductor laser devices face challenges in achieving reliable electrical conduction without the need for lead terminals, which can complicate the design and functionality.
Innovation Solution
A light emission device configuration that includes a base part with semiconductor laser devices, a frame body with a flat region and a throughhole for electrical conduction, and an electrical conduction member with conductive and insulative regions, allowing for electrical connection without lead terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead terminals are inserted in throughholes for electrical conduction, then electrical connection is achieved, but device complexity increases
Solution Approach 1:
The patent removes lead terminals from the device structure entirely. Instead of inserting lead terminals through the frame body, the invention uses a wiring board that makes direct contact with the semiconductor laser device, eliminating the need for lead terminals and their associated throughholes, thereby reducing device complexity while maintaining electrical conduction functionality
Solution Approach 2:
The frame body is designed to serve multiple functions: it provides structural support, contains the semiconductor laser device, and integrates the wiring board for electrical connection. This multi-functionality eliminates the need for separate lead terminals, simplifying the overall device structure while ensuring reliable electrical conduction
2Reliability
If lead terminals are used for electrical connection, then electrical conduction is established, but manufacturing precision requirements increase
Solution Approach 1:
By removing lead terminals and their insertion process, the patent eliminates the need for precise alignment and insertion of lead terminals into throughholes. The wiring board is instead bonded to the frame body and makes contact with the semiconductor laser device, which reduces manufacturing precision requirements and simplifies the assembly process
Solution Approach 2:
The wiring board is integrated with the frame body through bonding, combining two components into a unified structure. This integration eliminates the separate step of inserting lead terminals and reduces the number of assembly operations, thereby lowering manufacturing precision requirements while ensuring reliable electrical connection
Data Source
AI summary
A light emission device includes: a base part; a semiconductor laser device disposed on the base part; a frame body fixed to the base part and provided around the semiconductor laser device; a lid bonded to an upper surface of the frame body; and a first electrical conduction member bonded to an outer surface of the base part or an outer surface of the frame body, the first electrical conduction member having a first conductive region and a second conductive region that are electrically connected to the semiconductor laser device. In a top plan view, the first electrical conduction member includes a first portion overlapping the frame body and a second portion not overlapping the frame body, the first conductive region being contained in the first portion, and the second conductive region being contained in the second portion.