Two-Stage Laser Material Singulation for Defect-Free Glass Edges
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Solution Overview
Problem
Current material singulation processes, especially for brittle materials like strengthened glass, often introduce defects such as micro-cracks or chips due to mechanical forces, resulting in low yield rates and imperfect surfaces.
Innovation Solution
The use of two laser outputs, where the first laser modifies material properties and the second laser causes singulation with minimal defect introduction, creating smooth, defect-free surfaces by inducing specific physical changes in the material, such as molecular bond separation or heating effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical forces are applied to separate brittle materials, then singulation is achieved, but defects such as micro-cracks or chips are introduced
Solution Approach 1:
The patent replaces mechanical separation forces with a two-stage laser processing system. The first laser modifies material properties by creating a subsurface modified layer, and the second laser induces singulation through thermal stress or phase change within this modified zone. This substitution eliminates direct mechanical contact and force application, thereby preventing micro-cracks and chips while achieving efficient singulation.
Solution Approach 2:
The patent changes the physical and chemical parameters of the material through laser-induced modification. The first laser alters the material's structural, thermal, or mechanical properties in the subsurface region, creating a modified layer with different characteristics. The second laser then exploits these parameter changes to achieve clean separation. This parameter transformation allows singulation without the harmful effects of direct mechanical forcing.
2Productivity
If conventional singulation methods are used, then material separation is achieved, but surface quality deteriorates due to defects
Solution Approach 1:
The patent applies preliminary action by using the first laser to modify the material properties and create a prepared subsurface modified layer before the actual singulation occurs. This pre-modification creates a controlled zone that guides the subsequent separation process, ensuring that the second laser achieves clean separation with high surface quality. The preliminary modification prevents defects by establishing a favorable structural condition ahead of time.
Solution Approach 2:
The patent replaces mechanical separation methods that cause surface defects with a laser-based thermal/optical process. The second laser delivers energy precisely within the modified zone created by the first laser, inducing separation through thermal stress or phase change rather than mechanical force. This substitution produces smooth, defect-free surfaces while maintaining high processing efficiency.
3Device complexity
If a single laser is used for both modification and singulation, then device complexity is reduced, but manufacturing precision decreases
Solution Approach 1:
The patent segments the laser processing function into two distinct stages performed by two different lasers. The first laser is optimized for material modification, creating a subsurface modified layer with specific properties. The second laser is optimized for singulation, delivering precise energy to induce separation within the modified zone. This functional segmentation allows each laser to be tuned for its specific task, achieving high manufacturing precision while maintaining a manageable system complexity through modular architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of singulated products with smooth edges, uniform surfaces, and increased mechanical strength, reducing defects and improving the precision and efficiency of the singulation process.
Implementation Method 1
applying a first laser output to the stock material along a beam path, the first laser output causing a modification of a material property of the stock material along the beam path
Implementation Method 2
applying a second laser output along the beam path to cause separation of the singulated material from the stock material
Data Source
AI summary
Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.