Glass Severing Apparatus TRIZ Cases

Parallel scoring and rotation define rectangular panes from laminated glass sheets, cutting time by up to 50% compared to traditional sequential methods.

Ultrafast laser pulses form continuous C-shaped filaments inside transparent materials to enable precise singulation.

Replacing mechanical breaking with laser thermal scoring prevents unintended breakage and microcracks during high-speed glass plate separation.

A scribing tool assembly rotates about a vertical axis to orient tangentially along any predetermined path on multi-layered glass sheets.

A glass breaking method uses localized support to control crack propagation along complex cutting lines.

A paste with smaller alkali ions relaxes compressive stress in chemically toughened glass for precise cutting.

Alternating first and second focusing lenses branch laser beams into multiple optical paths for precise workpiece processing.

A glass cutting machine uses a movable clamp to grip and rotate sheet portions along the cutting line for precise positioning.

Localized thermal gradients separate glass blanks rapidly, replacing slow chemical etching to boost manufacturing throughput.

Spike-shaped laser damage structures enable rapid substrate cleaving without surface cracking or thermal damage.

A specialized glass composition enables uniform hole formation via ultraviolet laser irradiation and chemical etching.

A laser scribe method splits beams via birefringence to form multiple spot pairs for uniform cutting.

A two-stage pulsed laser method pretreats transparent workpiece surfaces to create scattering centers before final ablation cutting.

Preferential heating softens glass regions to form slits, allowing cladding layers to envelop the core layer and prevent exposure at severed edges.

A broadband pulsed fiber laser system generates a supercontinuum spectrum using nonlinear optical frequency conversion.

A dynamic optimizer adjusts cutting schedules and furnace layouts in real time to manage work piece placement.

Transparent auxiliary substrate connects to polished workpiece surfaces during laser processing to prevent conchoidal break-outs and maintain optical quality.

Rotating security wheels stabilize the cutting member while containing debris, reducing manual setup time and preventing glass breakage.

Ion exchange and polishing reduce core roughness depth in thin glass, preventing crack strength deterioration during pen drop tests.

Heating units soften sealants along cutting lines, enabling precise cutter movement that prevents substrate breakage and reduces scrap rates.

Merging independent mechanisms into one unit reduces the weight and size of glass processing heads while maintaining reliable tool adjustment.

A two-stage laser process modifies material properties before singulating brittle substrates to create smooth edges.

Triangulation detects the actual cutting edge orientation and adjusts it to prevent premature breaking of thin glass substrates.

Ultrashort pulse lasers generate periodic defect patterns that arrest incident cracks, eliminating heat-affected zones and sub-surface damage during cutting.

A modular bottle cutter uses a rotatable scoring arm to create precise circumferential marks on glass.

Nanosecond and ultrashort pulse laser sources deliver temporally overlapping pulse pairs to transparent materials for precise material modification.

Segmented cutting stations reduce offcut surface area while maintaining precise scoring accuracy for complex glass shapes.

A laser drilling method uses a pulsed beam to cut boundaries and a CO2 beam to heat material inside the preformed hole.

Chemical etching shapes mobile terminal cover glass edges to nanometer roughness without mechanical damage.

A rotating tool holder integrates multiple cutting wheels within a single glass cutting head assembly.

Laser damage regions define interrupted zones in glass substrates, enabling parallel etching singulation that reduces mechanical stress.

A picosecond laser generates elongated filaments in glass sheets using uncorrected spherical aberration.

A circumferential notch on a glass tube enables precise separation using longitudinal force pulses that generate internal stress waves.

Ring-shaped laser heating creates tempered glass areas that prevent chipping and maintain geometry, avoiding microcracks from mechanical processing.

Setting the heating zone length to less than 0.9 times the inner diameter minimizes axial oscillations and dimensional variations in drawn quartz glass tubes.

Dual Airy beams cross to form a curved intensity profile that scans glass substrates for precise edge rounding.

Inducing tensile stress exceeding glass strength at a notch separates preforms, eliminating chips and uneven edges.

Adjustable running rails and sensors dynamically modify cutting parameters for smooth or structured surfaces, eliminating equipment change time.

An annular infrared laser beam profile distributes energy adjacent to a contour line to separate glass substrates without overheating or cracking.

Laser thermal stress induces controlled crack propagation, resolving edge strength loss from mechanical scoring in thin glass.

Cutting glass films along a feed direction and polishing the surfaces prevents cracking from rubbing during winding, maintaining high production efficiency.

An asymmetrical cutting wheel biases surface cracks to one side of the glass substrate during rotation.

Combining laser irradiation with chemical etching solves isotropic precision limits and slow speeds in glass cliche manufacturing.

Downstream vibration regulation prevents cleaving accuracy deterioration from breaking vibrations without upsizing the manufacturing line.

A compact cutter head integrates a double curved surface member with transmission mechanisms to drive both the cutter wheel and roller wheel.

CO laser heating and mist cooling create controlled cracks in chemically strengthened glass without disrupting compressive-tensile stress balance.

Vertical vibration prevents the cutting wheel from riding on surface irregularities, ensuring stable crack propagation across LCD panel intersections.

Adjustable mirrors correct beam fluctuations to suppress aberration in laser machining devices.

Adjustable guide carriages and latching mechanisms resolve the contradiction between handling arbitrary workpiece widths and maintaining low device complexity.

Femtosecond pulses induce absorption to form fault lines, while a CO2 laser separates the material without generating debris or subsurface damage.