Liquid Crystal Substrate Cutting Device with Sealant Heating
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Solution Overview
Problem
Conventional liquid crystal substrate cutting devices face issues with cutting precision and product breakage due to sealant adhesion and uneven seal frame widths, leading to high scrap rates.
Innovation Solution
A cutting device equipped with a heating unit that softens the sealant along the cutting line, detected by an optical detector, and a cutter unit that precisely cuts the substrate, reducing adhesion and breakage by controlling the heating based on sealant presence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cutter wheel module is used to cut the liquid crystal substrate, then cutting precision is improved, but the risk of cutting abnormality and product breakage increases when seal frames adhere to each other
Solution Approach 1:
The heating unit is positioned ahead of the cutter unit and activates the sealant softening process before the cutting action occurs. This preliminary thermal treatment ensures the sealant is softened and removed from the cutting path before the cutter wheel makes contact, preventing adhesion-related cutting abnormalities and product breakage while maintaining cutting precision
Solution Approach 2:
The heating unit acts as an intermediary between the cutter wheel module and the sealant. By introducing thermal energy as an intermediate factor, the system softens and removes the sealant from the cutting path, allowing the mechanical cutting action to proceed without direct contact between the cutter and adherent sealant, thus preventing product breakage
2Productivity
If the distance between adjacent seal frames is reduced to save costs and improve utilization, then material utilization is improved, but the risk of seal frame adhesion increases
Solution Approach 1:
The system changes the temperature parameter of the sealant by applying localized heating through the heating unit. This parameter change (temperature increase) softens the sealant material, reducing its adhesion properties and allowing adjacent seal frames to be positioned closer together without risking adhesion-related cutting failures, thus enabling higher material utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces scrap rates by ensuring precise cutting of the liquid crystal substrate without abnormalities, such as cutting line deviation or breakage, through controlled heating and cutting processes.
Implementation Method 1
a heating unit, and the heating temperature range of the heating unit is from 120 Celsius degree to 150 Celsius degree
Implementation Method 2
heats the liquid crystal substrate to soften the sealant covered on the cutting line
Implementation Method 3
an optical detector unit detecting if the cutting line is covered with a sealant along the cutting line
Implementation Method 4
a cutter unit; the cutter unit moves along the cutting line to further cut the liquid crystal substrate
Data Source
AI summary
The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced.