Laser Irradiating Module With Cooling and Particle Shielding
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Solution Overview
Problem
Existing substrate treating apparatuses face challenges in precise etching due to light angle changes caused by particles or droplets, leading to inaccurate pattern formation, and suffer from maintenance issues due to heat and corrosion, resulting in poor efficiency and increased costs.
Innovation Solution
An irradiating module with a housing, laser unit, and cooling unit is designed to minimize damage from particles and heat, featuring a cooling fluid flow path and a cover with openings to manage light irradiation, ensuring precise etching and efficient operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the irradiator is used to irradiate light to the anchor pattern for precise etching, then the etching precision is improved, but particles or droplets attach to the irradiator causing corrosion and deterioration of durability
Solution Approach 1:
A protective cover is introduced as an intermediary component between the irradiator and the process environment. The cover includes a through hole that allows light passage while protecting the irradiator from particle and droplet attachment, preventing corrosion and durability deterioration without compromising etching precision
2Productivity
If the irradiator operates continuously to maintain production efficiency, then the productivity is improved, but the irradiator temperature rises causing heat damage
Solution Approach 1:
A cooling unit is introduced as a mediator to manage heat between the irradiator and the environment. The cooling unit includes a cooling fluid flow path that circulates coolant around the irradiator, absorbing excess heat and preventing thermal damage while allowing continuous operation to maintain productivity
3Manufacturing precision
If particles or droplets are present in the irradiation path, then the light irradiation path changes affecting etching accuracy, but adding protective measures increases device complexity
Solution Approach 1:
A protective cover with a precisely positioned through hole serves as a simple intermediary structure. The through hole is positioned to overlap with the light irradiation path, allowing light to pass through while blocking particles and droplets. This simple structural addition maintains etching accuracy without significantly increasing device complexity
Solution Approach 2:
The cooling unit utilizes fluid flow (hydraulic principle) to manage thermal conditions. A cooling fluid circulates through the cooling unit's flow path, using fluid dynamics to absorb and remove heat from the irradiator, providing thermal management through a well-understood physical mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module enables efficient substrate treatment with precise etching and reduced damage, maintaining apparatus durability and improving substrate treating efficiency.
Implementation Method 1
a cooling unit located in the accommodation space and exchanging heat with the laser irradiation unit
Implementation Method 2
a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light
Data Source
AI summary
The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.