Laser-Activatable Mold Compound for Semiconductor Package Interconnects
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Solution Overview
Problem
Semiconductor device packaging faces challenges in reducing parasitic electrical effects while maintaining high performance and reliability, often resulting in increased costs, larger package sizes, and complex manufacturing processes.
Innovation Solution
A molded package is created using a laser-activatable mold compound with laser-activated regions plated with conductive material to form metal pads and traces, allowing for direct structuring of interconnects without a lead frame, enabling controlled distance between active circuits and package I/Os and providing design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional packaging techniques are used to reduce parasitic electrical effects, then parasitic resistance and inductance are reduced, but package size increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the lead frame from the packaging structure, replacing it with direct metal traces formed in the mold compound. This removal of the intermediate lead frame component simplifies the overall structure and manufacturing process while maintaining electrical performance.
Solution Approach 2:
The patent merges the mold compound with the interconnect function by forming metal traces directly within the mold compound material. This integration eliminates the need for separate lead frames and reduces the number of discrete components, thereby simplifying manufacturing while reducing parasitic effects.
2Reliability
If lead frame is used for interconnection, then electrical connection is established, but package size increases and parasitic effects increase
Solution Approach 1:
The patent combines the interconnect function directly into the mold compound by forming metal traces within it. This integration eliminates the need for separate lead frames, reducing package volume while maintaining reliable electrical connections between the die and external terminals.
Solution Approach 2:
The patent transitions from planar lead frame interconnections to three-dimensional metal traces embedded within the mold compound volume. This dimensional change allows for more compact routing of electrical connections, reducing overall package size while maintaining connection reliability.
3Reliability
If lead frame is used for interconnection, then electrical connection is established, but parasitic resistance and inductance increase
Solution Approach 1:
The patent removes the lead frame from the interconnection structure and replaces it with direct metal traces formed in the mold compound. This extraction eliminates the additional interfaces and joints inherent in lead frame constructions, thereby reducing parasitic resistance and inductance while maintaining electrical connection reliability.
Solution Approach 2:
The patent incorporates metal traces directly into the mold compound during the molding process itself, creating pre-formed interconnect paths. This preliminary action eliminates the need for subsequent lead frame attachment and wiring steps, reducing parasitic effects introduced by additional connection interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces parasitic electric effects, minimizes package size, and simplifies manufacturing by eliminating the need for a lead frame, while maintaining high electrical and thermal performance.
Implementation Method 1
a laser-activatable mold compound having a plurality of laser-activated regions which are plated with an electrically conductive material
Data Source
Figure 1~2
Figure 3A~3C
Figure 4
AI summary
Embodiments of molded packages and corresponding methods of manufacture are provided. In an embodiment of a molded package, the molded package includes a laser-activatable mold compound (102) having a plurality of laser-activated regions (104) which are plated with an electrically conductive material to form metal pads (106) and/or metal traces (107) at a first side of the laser-activatable mold compound. A semiconductor die (108) embedded in the laser-activatable mold compound has a plurality of die pads (110) . An interconnect (112) electrically connects the plurality of die pads of the semiconductor die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound.