Laser-Activatable Mold Compound for Semiconductor Package Interconnects
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Solution Overview
Problem
Semiconductor device packaging faces challenges in reducing parasitic electrical effects such as resistance and capacitive coupling, which often result in higher costs, larger package sizes, and reduced performance, while maintaining high electrical and thermal performance and reliability.
Innovation Solution
A molded package using a laser-activatable mold compound with laser-activated regions plated with conductive material to form metal pads and traces, allowing for direct formation of interconnects without a lead frame, enabling controlled distance between the active circuit and package I/O and greater design freedom for interconnect placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional packaging techniques are used to reduce parasitic electrical effects, then parasitic resistance and capacitive coupling are reduced, but manufacturing cost increases, package size increases, and device performance decreases
Solution Approach 1:
The patent removes the lead frame from the packaging structure entirely, extracting only the essential encapsulation function while eliminating the parasitic interconnect structures. The semiconductor die is directly embedded in the mold compound with wire bonds providing electrical connections, thereby reducing parasitic electrical effects while simplifying the manufacturing process.
Solution Approach 2:
Instead of using a lead frame to support and interconnect the die, the patent inverts the approach by having the mold compound directly encapsulate the die and provide structural support. The electrical interconnection is achieved through wire bonds from die pads to external terminals formed directly on the mold compound, reversing the conventional hierarchy of support structures.
2Strength
If lead frame-based packaging is used, then structural support and electrical interconnection are provided, but parasitic resistance and inductance increase
Solution Approach 1:
The lead frame is completely removed from the packaging structure. The mold compound alone provides structural support and mechanical protection for the semiconductor die, while electrical interconnection is achieved through wire bonds and terminals formed directly on the mold compound surface, eliminating parasitic resistance and inductance associated with lead frames.
Solution Approach 2:
The patent uses a composite packaging structure where the mold compound serves multiple functions: structural support, mechanical protection, and electrical insulation. The combination of mold compound, wire bonds, and directly-formed terminals creates an optimized interconnection path that minimizes parasitic effects while maintaining structural integrity.
3Reliability
If complex interconnect structures are used to reduce parasitic effects, then electrical performance is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
Instead of using complex lead frame patterns and multiple interconnect layers to achieve low parasitic performance, the patent inverts the approach by using simple wire bonds from die pads to externally-formed terminals. The terminals are created directly on the mold compound surface through laser activation and plating, providing a straightforward manufacturing process that achieves excellent electrical performance without complexity.
Solution Approach 2:
The mold compound itself is used to form the terminal structures through laser activation of embedded metal particles followed by electroplating. This self-service approach eliminates the need for separate terminal fabrication processes and complex interconnect structures, reducing manufacturing cost while maintaining low parasitic electrical characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes parasitic electric effects, reduces costs, and enhances device performance by allowing flexible interconnect placement and design, while maintaining high electrical and thermal performance and reliability.
Implementation Method 1
directing a laser beam to specific regions of the mold compound to laser-activate the mold compound in such a manner that enables subsequent plating of the mold compound
Implementation Method 2
plating an electrically conductive material onto the laser-activated regions of the mold compound to form metal pads and/or metal traces
Data Source
AI summary
Embodiments of molded packages and corresponding methods of manufacture are provided. In an embodiment of a molded package, the molded package includes a laser-activatable mold compound having a plurality of laser-activated regions which are plated with an electrically conductive material to form metal pads and/or metal traces at a first side of the laser-activatable mold compound. A semiconductor die embedded in the laser-activatable mold compound has a plurality of die pads. An interconnect electrically connects the plurality of die pads of the semiconductor die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound.