Semiconductor Laser Mount Section with Protrusion for Heat Dissipation

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Solution Overview

Problem

Semiconductor laser devices face challenges in improving heat dissipation properties and are prone to deformation under external pressure, with issues in connecting short floating wires to the semiconductor laser element.

Innovation Solution

A semiconductor laser device design featuring a mount section with varying thicknesses, a retainer composed of insulative material, and lead pins extending through the retainer with bent sections, allowing for improved heat dissipation and wire connection without deformation, using resin molding and wire bonding techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the element mount section is made flush with the retainer to simplify structure, then manufacturing is easier, but heat dissipation properties deteriorate

Engineering Contradiction:

Improvestructural simplicityVSAvoidheat dissipation

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The element mount section is segmented into different height levels: a first height level that is flush with the retainer for simplified manufacturing, and a second height level that protrudes from the retainer to improve heat dissipation. This segmentation allows the structure to simultaneously achieve manufacturing simplicity and thermal performance.

Inventive Principle:

Principle #1Segmentation

2Volume of moving object

If the element mount section thickness is reduced to minimize size, then device compactness improves, but deformation resistance under external pressure deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoiddeformation resistance

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The element mount section employs varying thickness distribution: thinner in the central region where size minimization is critical, and thicker in the peripheral region where mechanical strength and deformation resistance are required. This local quality variation allows the structure to be compact while maintaining structural integrity.

Inventive Principle:

Principle #3Local quality

3Reliability

If floating wires are connected to the element mount section, then electrical connection is achieved, but wire length increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidwire length

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The element mount section protrudes in the vertical dimension from the retainer, creating a three-dimensional configuration. This vertical protrusion allows floating wires to be connected at a higher position, reducing wire length while maintaining electrical connection reliability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11081857B2Semiconductor laser device and manufacturing method therefor

Publication Date: 2021.08.03 SHARP FUKUYAMA LASER CO LTD

AI summary

A semiconductor laser device includes a semiconductor laser element, a sub mount member, a mount section having an upper surface on which the semiconductor laser element is mounted with the sub mount member interposed therebetween, a lead pin disposed at left and right sides of the mount section, a retainer that retains the mount section and the lead pin together and that is composed of an insulative material, and a protrusion protruding toward the left and right sides of the mount section. A lower surface of the mount section is parallel to an upper surface of the mount section and protrudes from a lower surface of the retainer.