Semiconductor Laser Package Layout for Resonance Suppression
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Solution Overview
Problem
Existing semiconductor laser light source devices face challenges in maintaining high frequency characteristics due to resonance issues caused by differences in thermal expansion coefficients and potential differences among components, particularly when transmitting signals above 20 Gbps, leading to degradation of frequency response characteristics.
Innovation Solution
The device incorporates a metal block between the second support block and the cap to absorb signals discharged from the second support block or temperature control module, thereby suppressing resonance and improving high frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a temperature control module is used to maintain constant temperature of the semiconductor optical modulation apparatus, then temperature stability is improved, but potential differences arise among components causing resonance and degradation of frequency response characteristics
Solution Approach 1:
An electrically conductive cap is introduced as an intermediary component to connect the metal stem, first support block, temperature control module, second support block, and housing. This cap provides a unified electrical potential reference across all components, preventing potential differences and resonance while maintaining temperature control functionality.
Solution Approach 2:
The electrically conductive cap creates an equipotential connection among all metal components (metal stem, support blocks, temperature control module), ensuring they share the same electrical potential. This eliminates voltage differences that would cause resonance and improves frequency response characteristics up to 20 Gbps and above.
2Reliability
If lead pins are sealed in and fixed to metal stem using glass with pressure from thermal expansion coefficient differences, then airtightness is improved, but structural constraints limit component mounting options and increase device complexity
Solution Approach 1:
The metal stem is designed to serve multiple functions simultaneously: it provides mechanical support for mounting components, ensures electrical connectivity through the conductive cap, and maintains airtight sealing through the glass-sealed lead pins. This multi-functionality reduces overall device complexity while maintaining reliability.
3Speed
If signal lines are transmitted through components with potential differences, then signal transmission is achieved, but resonance occurs causing degradation of frequency response characteristics at 20 Gbps and above
Solution Approach 1:
The electrically conductive cap creates equipotential connections among all components in the signal path, eliminating potential differences that cause resonance. This enables reliable signal transmission at 20 Gbps and higher speeds without frequency response degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal block effectively absorbs signals, reducing resonance and enhancing high frequency performance, as demonstrated by improved frequency response characteristics in simulations.
Implementation Method 1
a metal block which is provided between the second support block and the cap... a signal which is discharged from a second support block or a temperature control module to the space can be absorbed by a metal block
Data Source
AI summary
A semiconductor laser light source device includes a metal stem; a first support block provided on the metal stem and is electrically conductive; a temperature control module provided on the metal stem; a second support block provided on the temperature control module and is electrically conductive; a first substrate provided on a first side surface of the first support block; a second substrate provided on a second side surface of the second support bloc; a photosemiconductor chip provided on the second substrate; an electrically conductive cap provided on the metal stem and covers the first support block, the temperature control module, the second support block, the first substrate, the second substrate, and the photosemiconductor chip; and a metal block provided between the second support block and the cap.