Laser Panel Separation with Metal Retainers
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Solution Overview
Problem
Existing methods for producing printed circuit boards are complex and often require caustic chemicals and mechanical tools, leading to splintered edges and mechanical stress during panel separation, which complicates the process and reduces manufacturing accuracy.
Innovation Solution
A method using laser removal of circuit board base material with metal connections that protrude beyond the individual panel contours, allowing for contour-accurate and splinter-free separation by fixing the panels to the overall panel until complete removal, utilizing CO2 lasers to avoid cutting through metal connections and ensuring smooth edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical cutting tools are used to separate individual panels from the total panel, then the separation process can be completed, but the edges become splintered and mechanical stress is introduced into the panels
Solution Approach 1:
The patent replaces mechanical cutting tools with a laser beam for separating individual panels from the total panel. The laser beam ablates the circuit board base material along the contour of each individual panel without physical contact, eliminating mechanical stress and splintering while achieving clean, precise edges.
Solution Approach 2:
The laser beam utilizes thermal energy to ablate the circuit board base material by heating it to the point of vaporization or decomposition. This phase transition from solid to gas allows for clean removal of material without mechanical contact, preventing edge splintering and internal stress.
2Ease of manufacture
If caustic chemicals are used in the cutting process, then material removal can be achieved, but the process complexity increases and additional processing steps are required
Solution Approach 1:
The patent replaces chemical etching processes with laser ablation. The laser beam directly removes the circuit board base material through thermal ablation without requiring caustic chemicals, rinsing steps, or chemical waste处理, significantly simplifying the manufacturing process.
Solution Approach 2:
The patent extracts and eliminates the chemical processing steps from the manufacturing process entirely. By using laser ablation, the harmful chemical etching, rinsing, and neutralization steps are removed, leaving only the laser cutting and pushing operations.
3Ease of operation
If individual panels are completely removed from the total panel before metal connections are attached, then the panels can be freely positioned, but the panels may fall out or become misaligned during processing
Solution Approach 1:
The patent attaches metal connections to the individual panels before completely removing them from the total panel. These metal connections protrude through the laser-cut contours and provide temporary mechanical retention, preventing the panels from falling out or becoming misaligned during subsequent processing steps.
Solution Approach 2:
The metal connections serve as an intermediary element between the individual panels and the total panel. They provide a mechanical link that retains the panels in position during processing while allowing for eventual complete separation, solving the contradiction between free positioning and reliable retention.
4Productivity
If the laser beam power is increased to remove material faster, then productivity increases, but the metal connections may be cut through or damaged
Solution Approach 1:
The patent applies different laser parameters to different areas of the workpiece. When cutting through the circuit board base material, higher power settings are used for rapid material removal. When approaching or encountering metal connections, the laser power is automatically reduced or the beam is redirected, preventing damage to the metal connections while maintaining high productivity in the plastic material removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, stress-free separation of individual panels with improved manufacturing accuracy and reliability, allowing for optimal utilization of panel space and simplifying the assembly process without mechanical damage or reworking.
Implementation Method 1
the circuit board base material is removed by a laser beam having proven to be particularly suitable, in particular by a CO2 laser
Implementation Method 2
utilizing CO2 lasers to avoid cutting through metal connections and ensuring smooth edges
Data Source
Figure 1
Figure 2
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AI summary
The invention relates to a method for producing populated or unpopulated circuit boards or individual circuits as individual panels (2) from a complete panel (1) having a circuit board base material (4), wherein the particular individual panel (2) is removed from the complete panel (1) using a laser, wherein the individual panel is fastened to the complete panel (1) by means of metal connections (3) before the individual panel (2) is removed, the circuit board base material (4) is removed except for the metal connections (3), and the individual panels (2) are separated from, in particular pressed out of, the complete panel (1) after the circuit board base material (4) has been removed.