Laser Patterning Embedded PCB Manufacturing Process
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Solution Overview
Problem
Conventional methods for manufacturing printed circuit boards (PCBs) face challenges in securing reliability and achieving alignment accuracy, particularly in micro circuits and multi-layer PCBs, due to variations in patterns during photolithography and material adhesion.
Innovation Solution
A method that uses a laser to simultaneously or sequentially etch a photoresist layer and an insulating layer to form a circuit pattern, followed by filling with a plating material, simplifying the manufacturing process and improving alignment accuracy for multi-layer PCBs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photolithography methods are used to manufacture PCBs, then manufacturing cost is reduced and productivity is improved, but pattern variation and adhesion issues occur in micro circuits reducing reliability
Solution Approach 1:
The patent replaces the conventional photolithography process with a laser-based direct writing process. The laser beam directly patterns the photoresist and insulating layer without requiring photomask alignment, eliminating pattern variation issues and improving micro circuit reliability while maintaining manufacturing precision.
Solution Approach 2:
The patent introduces a photoresist layer as an intermediary between the laser processing and the insulating layer. The laser first patterns the photoresist, which then serves as a mask during subsequent etching of the insulating layer, enabling precise control over the circuit pattern formation and improving adhesion.
2Reliability
If conventional embedded PCB manufacturing methods are used, then circuit patterns are embedded in insulating layers, but the process becomes complicated and interlayer alignment is difficult
Solution Approach 1:
The patent combines multiple conventional steps into a single integrated laser processing step. The laser simultaneously or sequentially processes the photoresist layer and insulating layer in one pass, eliminating the need for separate alignment and pressing operations, thereby simplifying the manufacturing process while maintaining high alignment accuracy.
Solution Approach 2:
The patent performs preliminary laser patterning of the photoresist layer before etching the insulating layer. This preliminary action establishes precise alignment references that guide subsequent etching operations, ensuring accurate interlayer alignment without requiring complex mechanical alignment systems.
3Manufacturing precision
If laser etching is used to form circuit patterns, then alignment accuracy is improved and manufacturing process is simplified, but new manufacturing challenges may arise
Solution Approach 1:
The patent divides the laser processing into distinct sequential steps: first patterning the photoresist layer, then etching the insulating layer. This segmentation allows each step to be optimized independently, maintaining manufacturing feasibility while achieving high alignment accuracy through the photoresist mask guidance.
Solution Approach 2:
The patent utilizes different laser parameters (wavelength, power, pulse duration) to selectively process different materials. By adjusting laser parameters, the process can be optimized for photoresist removal in one step and insulating layer etching in the next, maintaining ease of manufacture while achieving precise alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and yield of PCBs by simplifying the manufacturing process and achieving precise alignment, thereby improving the quality of micro patterns and multi-layer PCBs.
Implementation Method 1
patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched
Implementation Method 2
filling the circuit pattern region with a plating material to form a circuit pattern
Data Source
AI summary
An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.