Laser Patterning Metal Film on Low Thermal Conductivity Substrates
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Solution Overview
Problem
Existing metal coating methods are costly and difficult to apply to resin molds with low chemical and thermal resistance, as they require large-scale facilities and chemical processes, making them unsuitable for substrates with inferior heat dissipation properties.
Innovation Solution
A metal coating method involving laser ablation, where a metal layer is formed on a substrate with different thermal conductivity members, using a laser beam to selectively remove the metal layer from the member with lower thermal conductivity, thereby patterning the metal film without the need for chemical etching or high-temperature exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional metal coating methods (photolithography and electrolytic plating) are used, then metal film patterning can be achieved, but equipment costs and process complexity increase significantly
Solution Approach 1:
The patent replaces the conventional photolithography and electrolytic plating system with a laser-based system. The laser beam directly patterns the metal film through selective ablation or controlled deposition, eliminating the need for photoresist materials, photolithography equipment, and electrolytic plating apparatus. This substitution of mechanical/chemical processes with optical energy delivery simplifies the overall manufacturing system while maintaining patterning precision.
Solution Approach 2:
The patent utilizes controlled variation of laser parameters (wavelength, pulse duration, power density, scanning speed) to achieve precise metal film patterning. By adjusting these parameters, the laser can selectively remove or deposit metal in desired patterns directly on the substrate, replacing complex multi-step conventional processes with a controllable single-step optical process.
2Reliability
If large-scale facilities and chemical processes are used for metal coating, then corrosion protection can be achieved, but chemical resistance requirements increase process difficulty for resin molds
Solution Approach 1:
The patent replaces chemical etching and chemical deposition processes with laser-based physical processes. The laser beam directly interacts with the metal film and substrate through ablation or localized heating, eliminating the need for chemical etchants, photoresist solvents, and electrolytic solutions. This substitution makes the process compatible with resin molds that have low chemical resistance, as no aggressive chemicals are introduced during manufacturing.
Solution Approach 2:
The patent converts the low chemical resistance of resin molds from a manufacturing limitation into an advantage by using a process that introduces no chemicals. The laser process actually benefits from the resin's chemical inertness, as the mold material itself becomes compatible with the chemical-free manufacturing approach, enabling production of corrosion-resistant components without compromising the mold integrity.
3Manufacturing precision
If conventional metal coating methods are used, then metal film formation can be achieved, but thermal resistance of substrates limits applicability to resin molds
Solution Approach 1:
The patent segments the energy delivery process into localized laser spots that treat only small regions at a time. By focusing the laser beam to a small spot size and scanning it across the substrate, the process delivers thermal energy in highly localized zones rather than heating the entire substrate. This segmentation of thermal processing enables work on substrates with low thermal conductivity, as heat does not accumulate or spread uncontrollably throughout the resin mold.
Solution Approach 2:
The patent employs pulsed laser operation with controlled duty cycles and pulse durations. The periodic on-off action of the laser allows brief intervals for heat dissipation between pulses, preventing thermal buildup in substrates with low thermal resistance. This periodic energy delivery enables precise metal film formation on resin molds without exceeding their thermal tolerance limits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces equipment costs and enables metal film formation on substrates with low chemical and thermal resistance, improving efficiency and simplifying the process by leveraging the thermal conductivity difference between substrate members.
Implementation Method 1
irradiating the metal layer formed on the first member and the second member with a laser beam such that, after irradiation, the metal layer formed on the first member remains, and the metal layer formed on the second member is removed
Data Source
AI summary
A light-emitting device includes: a light-emitting element; a coating member that covers the light-emitting element; and two external connection electrodes exposed form a first surface of the coating member. Each of the external connection electrodes includes an electrode buried in the coating member; and a metal layer formed on the electrode. A surface of each of the metal layers is exposed from the first surface of the coating member. The first surface of the coating member includes a plurality of grooves between the external connection electrodes.