Laser-Resistant Metallic Pattern for Substrate Component Integration

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Solution Overview

Problem

The existing process of burying electronic components in a circuit substrate is complicated due to the need for accurate laser drilling through a solder mask layer, which is challenging with thin core layers and results in increased fabrication difficulty and complexity.

Innovation Solution

A substrate structure with a component-disposing area that includes a core layer, a first dielectric layer, a laser-resistant metallic pattern, and a second dielectric layer, where the laser-resistant metallic pattern surrounds a projection area to prevent laser penetration, allowing for simpler integration of dielectric layers and avoiding the need for a solder mask layer, thereby simplifying the manufacturing process and improving yield rates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a solder mask layer is formed and laser drilling is used to create open holes for component disposal, then electronic components can be buried in the substrate, but the process becomes complicated and difficult to control due to the need for accurate laser depth control through thin core layers

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidlaser drilling depth control

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention extracts and removes the solder mask layer from the substrate structure. By eliminating this layer, the complex process of forming precise open holes through laser drilling is avoided, as there is no need to control laser penetration through the solder mask. The component disposal area is created directly in the core layer without requiring a solder mask overlay.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of forming open holes through the solder mask layer using laser drilling (the conventional approach), the invention inverts the approach by creating the component disposal area directly in the core layer first, then forming dielectric layers over it. This reverses the traditional sequence and eliminates the need for precise laser depth control through thin layers.

Inventive Principle:

Principle #13The other way round (Inversion)

2Ease of manufacture

If separate processes are performed for solder mask formation and component disposal, then components can be electrically connected through pads, but the fabrication difficulty and process complexity increase

Engineering Contradiction:

Improveprocess integrationVSAvoidprocess steps

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The invention merges the component disposal process with the dielectric layer formation process. The component disposal area is created as part of the core layer preparation, and subsequent dielectric layers are formed over this area in the same fabrication sequence as other circuit layers. This integration eliminates separate solder mask formation and component disposal steps, reducing overall process complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Length of moving object

If the core layer thickness is reduced to less than 100 microns to achieve thin substrate design, then the substrate becomes lighter and thinner, but laser drilling through the solder mask layer becomes extremely challenging

Engineering Contradiction:

Improvesubstrate thicknessVSAvoidlaser drilling accuracy

Core Design Contradiction:

Length of moving objectVSManufacturing precision

Solution Approach 1:

The invention extracts and removes the solder mask layer that would otherwise need to be laser-drilled through. By eliminating this layer, the problematic laser drilling step is completely avoided, making thin substrate fabrication feasible without the precision control issues that arise when drilling through ultra-thin solder mask layers.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the substrate manufacturing process by eliminating the need for separate solder mask formation and laser depth control, enhancing the production yield rate and facilitating the integration of electronic components within the substrate.

Implementation Method 1

a laser-resistant metallic pattern is formed on the first dielectric layer... surrounds a projection area of the first dielectric layer which the component-disposing area is orthogonally projected on

Methodology Applied

Scientific EffectLaser absorption: Absorption (EM radiation)

Data Source

PatentUS9646852B2Manufacturing process for substrate structure having component-disposing area

Publication Date: 2017.05.09 UNIMICRON TECH CORP

AI summary

A process for a substrate having a component-disposing area is provided, and includes the following steps. A core layer including a first surface, a metallic layer and a component-disposing area is provided. The metallic layer is disposed on the first surface and patterned to form a patterned metallic layer including pads located in the component-disposing area. A first dielectric layer is formed on the first surface and covers the patterned metallic layer. A laser-resistant metallic pattern is formed on the first dielectric layer and surrounds a projection area of the first dielectric layer. A release film is disposed on the projection area and covers a portion of the laser-resistant metallic pattern within the projection area. A second dielectric layer is formed on the first dielectric layer and covers the release film and the laser-resistant metallic pattern. A first open hole and a plurality of second open holes are formed.