Laser-Roughened Lead Frame Resin Adhesion

Solution Overview

Problem

There is a need for enhanced adhesion between resin members and other components in electronic devices, such as between a resin member and a support member or a mount member, to maintain airtightness and reliability, which existing methods do not adequately address.

Innovation Solution

The method involves irradiating the support member with a laser after mounting the mount member to create a rough surface, allowing material accumulation and enhancing adhesion between the resin member and the support or mount member, using a resin to seal the electronic device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the lead frame surface is irradiated with laser to roughen it before mounting the electronic component, then the adhesion between the lead frame and the resin body is enhanced, but the manufacturing process becomes more complex and time-consuming

Engineering Contradiction:

Improveadhesion between lead frame and resin bodyVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The laser irradiation is performed as a preliminary action before mounting the electronic component and before the resin molding process. By roughening the lead frame surface in advance, the adhesion between the lead frame and resin body is enhanced, ensuring reliable sealing. This preliminary treatment integrates smoothly into the existing manufacturing flow without requiring additional complex equipment or processes.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If the lead frame surface is irradiated with laser to roughen it, then the adhesion between the lead frame and the resin body is enhanced, but the manufacturing time increases

Engineering Contradiction:

Improveadhesion between lead frame and resin bodyVSAvoidmanufacturing cycle time

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The laser irradiation is performed as a preliminary action before mounting the electronic component and before the resin molding process. By roughening the lead frame surface in advance, the adhesion between the lead frame and resin body is enhanced, ensuring reliable sealing. This preliminary treatment integrates smoothly into the existing manufacturing flow without requiring additional complex equipment or processes.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly improves the adhesion between the resin member and other components, enhancing the reliability of the electronic device while preventing resin peeling, particularly at stress-prone areas like corners, thus maintaining airtightness and device stability.

Implementation Method 1

irradiating the lead frame with laser to roughen the lead frame

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

a rough portion on which the material of the support member accumulates

Methodology Applied

Scientific EffectMelting: Melting

Data Source

PatentUS11517982B2Electronic device and method for manufacturing the same

Publication Date: 2022.12.06 DENSO CORP

AI summary

An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.