Laser Singulation Through Mounting Tape for Semiconductor Wafer
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Solution Overview
Problem
The existing semiconductor wafer singulation processes introduce contaminants and debris, leading to defects and require extensive handling, which can result in breakage and inefficiencies in producing smaller, higher-density semiconductor devices.
Innovation Solution
A method involving the use of a mounting tape to apply irradiated energy to a non-active region of a semiconductor wafer, creating a modified region for precise singulation, thereby reducing contamination and handling risks while enabling more efficient separation of semiconductor die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a saw blade or laser cutting tool is used to singulate the semiconductor wafer, then the semiconductor die can be separated into individual devices, but contaminant material or debris is introduced over the semiconductor wafer requiring extensive cleaning processes
Solution Approach 1:
The patent replaces the mechanical saw blade cutting system with a laser-based modification system that works through the mounting tape. The laser modifies the material properties of the non-active region without direct mechanical contact, thereby eliminating the introduction of contaminant material and debris associated with mechanical cutting while maintaining singulation effectiveness.
Solution Approach 2:
The mounting tape serves as an intermediary medium that allows laser energy to pass through to modify the non-active region of the semiconductor wafer. This intermediary approach enables the laser to singulate the wafer without direct contact, avoiding contaminant introduction while still achieving precise separation along the non-active region.
2Ease of operation
If the semiconductor wafer is handled extensively during mounting and removal processes, then the semiconductor die can be mounted to the mounting tape, but die shifting and breakage or damage occur
Solution Approach 1:
The patent performs the singulation modification through the mounting tape while the wafer is still mounted, before any removal or handling operations. By completing the singulation process in this preliminary state, the semiconductor die remain securely attached during the modification process, preventing die shifting and reducing handling-related breakage or damage.
Solution Approach 2:
The patent replaces mechanical handling and removal processes with a laser-based modification approach that works through the mounting tape. This substitution eliminates the need for extensive manual handling and removal operations that cause die shifting and breakage, while still achieving effective singulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes contaminant introduction, reduces the risk of damage, and allows for more efficient production of smaller, higher-density semiconductor devices with improved yield and reduced processing steps.
Implementation Method 1
applying irradiated energy to the non-active region through the mounting tape to form a modified region within the non-active region
Implementation Method 2
applying irradiated energy to the non-active region through the mounting tape to form a modified region within the non-active region
Implementation Method 3
applying irradiated energy to the non-active region through the mounting tape to form a modified region within the non-active region
Data Source
AI summary
A semiconductor device has a semiconductor wafer with a plurality of semiconductor die separated by a non-active region. The semiconductor die can be circular or polygonal with three or more sides. A plurality of bumps is formed over the semiconductor die. A portion of semiconductor wafer is removed to thin the semiconductor wafer. A wafer ring is mounted to mounting tape. The semiconductor wafer is mounted to the mounting tape within the wafer ring. The mounting tape includes translucent or transparent material. A penetrable layer is applied over the bumps formed over the semiconductor wafer. An irradiated energy from a laser is applied through the mounting tape to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die.