Laser Slicing of Brittle Workpieces Without Melting or Cracks
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Solution Overview
Problem
Existing methods for cutting materials with hot brittleness, such as glass and ceramic, suffer from low yield and excessive defects due to cracks and thermal damage, leading to deteriorated workability and reduced production efficiency.
Innovation Solution
A cutting device and method using a laser that generates a laser beam focused below the melting point to heat and cut the material, causing internal stress for separation without melting, accompanied by simultaneous cooling and a start point damage mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam is used to cut materials with hot brittleness, then cutting speed and productivity are improved, but thermal damage and cracks occur causing low yield
Solution Approach 1:
The patent applies parameter changes by precisely controlling laser beam parameters (power, focal position, scanning speed) to maintain the material temperature below the melting point. This prevents thermal damage and cracks while achieving efficient cutting, thereby resolving the contradiction between high productivity and high yield.
Solution Approach 2:
The patent converts the potentially harmful thermal effect into a beneficial cutting mechanism by using controlled heating below the melting point to create precise cuts without thermal damage. The laser energy is transformed from a potential source of thermal damage into a precise cutting tool that improves both speed and yield.
2Productivity
If high power laser is used to increase cutting speed, then productivity improves, but melting and vaporization of workpiece occurs causing defects
Solution Approach 1:
The patent employs parameter changes by optimizing laser power, focal position, and scanning speed to achieve cutting speeds that improve productivity while maintaining the workpiece temperature below the melting point. This prevents melting and vaporization defects, thereby maintaining high manufacturing precision.
Solution Approach 2:
The patent applies dynamics by continuously adjusting laser parameters during the cutting process based on real-time conditions. The focal position and power are dynamically controlled to prevent melting while maintaining high cutting speed, resolving the contradiction between productivity and surface quality.
3Manufacturing precision
If traditional cutting methods are used to avoid thermal damage, then manufacturing precision is maintained, but multiple additional processes are required reducing workability
Solution Approach 1:
The patent extracts the thermal damage problem by using a specialized laser cutting method that operates below the melting point, eliminating the need for subsequent thermal damage removal processes. This maintains manufacturing precision while improving ease of manufacture by reducing additional processing steps.
Solution Approach 2:
The patent replaces traditional mechanical cutting methods with a controlled laser heating method that avoids mechanical contact and subsequent thermal damage. This substitution maintains cutting surface quality while improving workability by eliminating multiple additional processing steps.
4Ease of manufacture
If laser cutting is used to reduce post-processing, then ease of manufacture improves, but cracks and thermal damage occur reducing yield
Solution Approach 1:
The patent applies parameter changes by precisely controlling laser power and scanning speed to prevent thermal damage and cracks during cutting. This maintains high yield while achieving ease of manufacture through reduced post-processing requirements.
Solution Approach 2:
The patent converts the potential harm of laser-induced thermal damage into a benefit by using controlled sub-melting-point heating that eliminates the need for post-processing while maintaining high yield. The laser energy is transformed into a precise cutting tool that improves both ease of manufacture and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively cuts materials with minimal damage, improving workability and productivity by reducing the need for post-processing.
Implementation Method 1
a laser generation unit configured to generate a laser beam that is transmitted through a surface of a workpiece and partially absorbed into the workpiece
Implementation Method 2
causing internal stress to separate a cut part from the workpiece
Implementation Method 3
a cooling unit configured to cool a workpiece
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
Disclosed are a cutting device and method using a laser, which comprises: a laser generation unit which generates a laser beam capable of penetrating the surface of a workpiece and is partially absorbed into the workpiece, a beam generation optical unit focuses the laser beam in a shape that is parallel to the surface of the workpiece and extends perpendicular to the processing direction, the workpiece is heated to a temperature that creates sufficient internal stress to separate the cut part from the workpiece while being below the melting point of the workpiece, the start point generation unit generates damage at the cutting start point outside the cutting surface to be cut in the workpiece, accordingly, the configuration enables a workpiece having thermal brittleness to be sliced to the desired thickness without melting the workpiece or causing significant damage.