Laser Substrate Positioning via Reference Point Priority
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Solution Overview
Problem
Existing methods for forming openings in substrates for printing stencils or masks face challenges in maintaining positional accuracy due to changes in the state of stress caused by the formation process, leading to unwanted shifts of openings, which are typically addressed through complex predictive models or additional processing steps.
Innovation Solution
Determining the coordinates of a reference point in a central region and using these to calculate the distances and priority of opening positions, incorporating machining characteristics and material properties, to maintain a constant state of stress and prevent shifts by optimizing the machining sequence and path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If openings are formed in a substrate using a laser or cutting technique, then the substrate is weakened and the state of stress changes, but this causes unwanted positional shifts of the openings
Solution Approach 1:
The patent applies preliminary action by calculating and determining the machining sequence before actual opening formation. The distances from a reference point to all opening positions are computed in advance, and an optimized machining sequence is established that minimizes stress-induced positional shifts. This pre-planned sequence is then executed during laser machining, preventing the harmful effect of stress changes rather than correcting them afterward.
2Productivity
If all openings are formed in one operation, then productivity is improved, but positional shifts occur due to stress changes during machining
Solution Approach 1:
The patent determines the optimal machining sequence in advance by calculating distances from a reference point to all opening positions. This pre-computed sequence allows all openings to be formed in a single operation while maintaining positioning accuracy, as the laser follows the optimized path that minimizes stress-induced shifts throughout the entire machining process.
Solution Approach 2:
The patent introduces dynamics by adapting the machining sequence to the specific geometry and distribution of openings. Rather than using a fixed or arbitrary machining order, the sequence is dynamically optimized based on the calculated distances from the reference point, allowing the process to accommodate different substrate configurations while maintaining precision and productivity.
3Manufacturing precision
If a reference point is determined and machining sequence is optimized based on distances, then the complexity of the machining program increases, but positional accuracy is maintained
Solution Approach 1:
The patent replaces complex mechanical stress analysis and predictive modeling with a simplified computational approach. Instead of using complicated predictive models to estimate stress changes, the method substitutes a straightforward distance calculation from a reference point to determine the optimal machining sequence. This computational substitution maintains positioning accuracy while significantly reducing program complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents positional shifts of formed openings by compensating for stress changes, allowing for efficient and accurate formation of openings with reduced need for additional processing steps and improved reproducibility.
Implementation Method 1
a substrate is frequently used in practice as a printing stencil... to form openings having predetermined positions in a substrate, in particular to manufacture stencils or masks using a laser
Data Source
AI summary
A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.