Radiation Applications TRIZ Cases
- LDS Thermoplastic Composition Using Metal Oxide and Powder Additives
A blended LDS thermoplastic uses metal oxide and metal powder additives to improve plating consistency while limiting polymer matrix degradation.
- Silicon Resist Underlayer Composition for Sub-25 Nm Pattern Stability
A polysiloxane ester underlayer film prevents resist pattern collapse below 25 nm while using more accessible silicon materials.
- Organometallic Photoresist Composition for Low-Roughness Lithography
Light-triggered ligand dissociation builds an organometallic network that improves photoresist storage stability, resolution, and etch resistance.
- Resist Underlayer Film Baking Under Inert Gas for Higher Hardness
High-temperature inert-gas baking hardens resist underlayer films and improves etching resistance for finer lithography patterning.
- Tin Photoresist Composition for EUV Pattern Resolution
Direct EUV photopolymerization in a tin photoresist improves sensitivity while limiting image blurring and line edge roughness.
- Resist Underlayer Composition With Crosslinked Hardness for Etching
Hydroxymethyl and ROCH2 polymer units form a harder resist underlayer that reduces sublimate contamination and improves etching resistance.
- Photosensitive Resin Composition for Low-Loss Strong Cured Films
Combining polyimide and cyclic olefin resin enables radical-free photodimerization while improving cured film strength and lowering dielectric loss.
- Aromatic Resist Underlayer Composition for Thin EUV Film Uniformity
Specific aromatic polymer structures keep ultra-thin EUV underlayer films uniform, adhesive, and solvent-resistant for finer resist patterns.
- Silicon Resist Underlayer Composition for High Wet Etch Rate
Hydroxy-group polysiloxane with nitric acid enables a silicon resist underlayer film with strong lithography and fast wet or dry etching.
- Silicon Resist Underlayer Composition Balancing Wet Etch and Lithography
A polysiloxane and strong-acid underlayer film enables fast wet removal while preserving lithography quality and reducing dry-etch substrate damage.
- Polysiloxane Resist Underlayer Composition for 10 Nm Pattern Integrity
A low-molecular-weight polysiloxane underlayer enables 10 nm or thinner resist films to keep pattern shape and avoid collapse in lithography.
- LED Converter Composition Using FRET to Excite Eu3+ Phosphors
A separate sensitizer absorbs blue-violet light and transfers energy to Eu3+ phosphors, boosting emission while limiting quenching losses.
- Laser-Etched Touch Sensor Tracks for Accurate Capacitance Sensing
Laser-etched conductive tracks link touch electrodes to pads with consistent coupling, improving capacitance sensing accuracy and simplifying layout changes.
- Optically Reconfigurable RF Fabric for Dynamic Transmission Lines
Controllable illumination patterns create and reconfigure RF transmission lines in a photosensitive layer without fixed PCB traces or added switches.
- Resist Underlayer Film Composition for EUV Pattern Uniformity
A polymer underlayer balances adhesion and intermixing resistance to form uniform EUV resist films with fewer pinholes and finer patterns.
- Radioactivity Calibrator With Voice Control for Ergonomic Operation
Manual isotope selection divides operator attention; microphone, recognition, and control modules enable more ergonomic calibrator operation.
- Photoresist Layer Formation Using Dynamic Spin Speed Control
A photoresist coating method adjusts wafer rotation speed during pre-wet solvent dispensing to ensure uniform surface coverage.
- Resist Topcoat Copolymer for EUV Pattern Dispersion Control
A resist topcoat copolymer absorbs EUV light to reduce acid concentration at the photoresist surface.
- Multilayer PCB Through-Hole Conductor Stress Dispersion
Segmenting the penetrating hole with a constant-diameter middle portion disperses stress at the conductor juncture, preventing cracking and peeling.
- Silphenylene Polymer Photo-Curable Resin for Low-Temperature Curing
A silphenylene-bearing photo-curable resin composition cures at low temperatures to form patterned films with high adhesion and chemical resistance.
- Resist Underlayer Composition for Fine Patterning
A resist underlayer composition uses specific polymers and a stable photoacid generator to enhance exposure sensitivity.