Laser Substrate Separation for Semiconductor Package Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor package manufacturing methods using metal substrates require frequent dicing blade replacement and can result in sharp edges with acute angles, leading to blade abrasion and safety hazards during mechanical separation of packages.
Innovation Solution
A manufacturing method involving the formation of grooves in a resin insulating layer covering semiconductor devices, followed by laser irradiation of the substrate to separate individual packages, reducing dicing blade wear and smoothing the substrate edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dicing blade is used to mechanically separate semiconductor packages on a metal substrate, then the packages can be separated into individual pieces, but the dicing blade is abraded and needs frequent replacement
Solution Approach 1:
The patent replaces the mechanical dicing blade cutting system with a laser-based separation system. The laser irradiates the metal substrate through pre-formed grooves to separate the semiconductor packages, eliminating direct mechanical contact between the blade and substrate. This substitution resolves the blade abrasion problem while maintaining high productivity through efficient laser separation.
Solution Approach 2:
The patent employs pre-formed grooves in the metal substrate before the final separation step. These grooves are created using a dicing blade or other methods, and then laser irradiation is applied through these grooves to complete the separation. This preliminary action reduces the workload on the dicing blade and enables the transition to laser-based separation, extending blade life while maintaining manufacturing efficiency.
2Productivity
If a dicing blade is used to cut the metal substrate for package separation, then individual packages are obtained, but sharp edges with acute angles are formed causing safety hazards
Solution Approach 1:
The patent replaces mechanical cutting with laser irradiation for the final separation step. The laser melts and vaporizes the metal substrate material, creating smooth, rounded edges instead of sharp acute angles. This eliminates safety hazards associated with sharp edges while maintaining high separation efficiency through the localized and precise nature of laser processing.
Solution Approach 2:
The patent utilizes phase transitions of the metal substrate material during laser irradiation. The laser energy causes the metal to transition from solid to liquid and then to vapor phase, creating a smooth separation surface. This phase transition mechanism naturally produces rounded edges without sharp corners, eliminating safety hazards while maintaining productive separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method extends dicing blade lifespan, decreases maintenance frequency, and ensures safer edge profiles by using laser separation to smooth the substrate surfaces.
Implementation Method 1
irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other
Data Source
AI summary
A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the substrate with laser light in positional correspondence with the grooves to separate the plurality of semiconductor devices from each other.