Laser Transfer Bonding of Electronic Components With Pre-Applied Adhesive
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Solution Overview
Problem
The existing manufacturing process for electronic devices using laser transfer technology is complex and results in a low yield rate due to the multiple steps required for transferring and fixing electronic components from one carrier to another before bonding them to a final substrate.
Innovation Solution
A simplified manufacturing method involving a first substrate with electronic components and a target substrate separated by a distance, where adhesive material is applied to the components, and then transferred using a laser process to attach them to the target substrate via an adhesive layer, which can be anisotropic conductive paste or flux, simplifying the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional multi-step laser transfer process is used to transfer electronic components from one carrier to another before bonding, then the components can be fixed on the final substrate, but the manufacturing process complexity increases and yield rate decreases
Solution Approach 1:
The patent combines the transfer process and bonding process into a single integrated operation. The adhesive layer is applied to the target substrate before the transfer process, so that when electronic components are transferred via laser, they are simultaneously bonded to the substrate. This eliminates the need for separate transfer and bonding steps, reducing process complexity and improving yield rate.
Solution Approach 2:
The adhesive layer is applied in advance to the target substrate before the transfer process begins. This preliminary action ensures that the bonding capability is already in place, so that when the electronic components are transferred, they can be immediately bonded without requiring additional bonding steps afterward.
2Productivity
If multiple transfer steps are performed to move electronic components between carriers, then components reach the final substrate, but the manufacturing time increases and productivity decreases
Solution Approach 1:
The patent merges the transfer operation and bonding operation into a single simultaneous process. By having the adhesive layer already in place on the target substrate, the laser transfer process accomplishes both the physical transfer of components and their bonding to the substrate in one step, eliminating the time required for separate bonding operations.
Solution Approach 2:
The process maintains continuous useful action by eliminating idle time between transfer and bonding operations. The adhesive layer is prepared in advance, so that the moment components are transferred, they are immediately bonded without interruption, maximizing the efficiency of each step in the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the complexity of the manufacturing process and improves the yield rate by directly transferring and bonding electronic components to the target substrate using adhesive material, enhancing the efficiency of the electronic device manufacturing process.
Implementation Method 1
transferring at least part of the electronic components adhered with the adhesive material to the target substrate through a laser process
Implementation Method 2
at least part of the electronic components are attached to the target substrate via the adhesive material
Data Source
AI summary
A manufacturing method of an electronic device includes: providing a first substrate, which has a base layer and a plurality of electronic components disposed on the base layer; adhering adhesive material to each of the plurality of electronic components; providing a target substrate, wherein the target substrate and the first substrate are separated from each other by a distance; and transferring at least part of the plurality of electronic components adhered with the adhesive material to the target substrate through a laser process, wherein at least part of the plurality of electronic components are attached to the target substrate via the adhesive material.