Laser Device Transfer With Grouped Position Correction
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Solution Overview
Problem
Current high-speed device transfer methods, such as the stamp method, face challenges in achieving both high positional accuracy and efficiency due to limitations in correcting positional deviations in arrays of micro devices, leading to increased costs and time when using multiple machines.
Innovation Solution
A device transfer method that involves acquiring actual positional information of devices on a first substrate, grouping them based on predetermined criteria, correcting the relative positions of the substrates, and using laser irradiation to transfer devices to a second substrate, ensuring high-speed transfer with improved positional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If batch transfer by stamp method is used to achieve high-speed transfer, then productivity is improved, but manufacturing precision deteriorates due to positional deviation of ±30 μm from dicing tape stretching
Solution Approach 1:
The patent measures and records the actual positional information of each device on the first substrate before transfer. Based on this preliminary data, the system calculates and determines the optimal second substrate position that will accommodate all devices within the target positional deviation range (±10 μm). This preliminary action enables batch transfer without requiring individual device adjustment during the transfer process.
Solution Approach 2:
The system changes the positional parameters of the second substrate relative to the first substrate based on the measured device positions. By adjusting the second substrate's position and orientation parameters, the patent compensates for the ±30 μm deviations from dicing tape stretching, ensuring all transferred devices fall within the ±10 μm target accuracy range while maintaining high-speed batch transfer capability.
2Manufacturing precision
If devices are transferred one by one with positional deviation correction to improve manufacturing precision, then manufacturing precision is improved, but productivity deteriorates due to increased transfer time
Solution Approach 1:
The patent performs preliminary measurement of all device positions on the first substrate and pre-calculates the optimal second substrate position before the actual transfer begins. This eliminates the need for sequential measurement and correction during transfer, enabling all devices to be transferred in a single batch operation while achieving ±10 μm mounting accuracy.
Solution Approach 2:
The system merges multiple correction operations into a single substrate-level correction. Instead of correcting each device's position individually during transfer, the patent calculates one optimal second substrate position that simultaneously corrects the positions of all devices, enabling parallel batch transfer that maintains high precision while preserving productivity.
3Manufacturing precision
If multiple machines are used to correct positional deviations to improve manufacturing precision, then manufacturing precision is improved, but device complexity increases and cost increases
Solution Approach 1:
The patent implements a multi-functional system where a single transfer machine performs both high-speed batch transfer and positional deviation correction functions. The system uses image processing to measure device positions, calculates optimal substrate positioning, and executes the corrected transfer all in one device, eliminating the need for separate correction machines and reducing overall system complexity.
Solution Approach 2:
The patent combines multiple previously separate functions (device positioning measurement, positional deviation calculation, second substrate positioning, and batch transfer) into a single integrated system. This merging reduces the number of machines required from multiple separate systems to one unified transfer machine, thereby reducing device complexity and associated costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of second substrates with devices having allowable positional deviations at high speed, maintaining accuracy and reducing transfer time and costs compared to existing techniques.
Implementation Method 1
continuously irradiating only the devices included in the selected group with laser from a back surface of the first substrate to transfer the devices to the second substrate
Implementation Method 2
continuously irradiating only the devices included in the selected group with laser from a back surface of the first substrate to transfer the devices to the second substrate
Data Source
AI summary
Proposed are a method and an apparatus for transferring devices arranged on a first substrate to a second substrate by using laser light while correcting positional deviations of the devices. The present invention involves: acquiring actual positional information about devices on the first substrate; performing grouping in accordance with a criterion determined on the basis of an allowable positional deviation amount; correcting, for each group unit, a position of the first substrate such that positions of the devices fall into a range of an allowable positional deviation amount; and applying laser light from the back surface of the first substrate and transferring the devices to the second substrate.