Laser Ventilation Holes in Electrode Plates
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Solution Overview
Problem
Current methods for forming ventilation holes in electrode plates for plasma processing apparatuses are inefficient in terms of productivity and require multiple steps, including forming pilot holes and machining inner surfaces, which can lead to low precision and increased processing time, especially when dealing with materials like silicon carbide.
Innovation Solution
A method involving a surface roughening step to achieve a specific center line average roughness followed by a single-step laser beam irradiation process using a wavelength of 200 nm to 600 nm, where the laser focus spot is swirled and moved in a circular pattern to form ventilation holes directly through the electrode plate, eliminating the need for pilot holes and reducing machining damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple steps (pilot hole formation + inner surface machining) are used to form ventilation holes with high precision, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The patent replaces mechanical drilling and machining operations with laser beam irradiation. The laser beam directly forms ventilation holes through ablation without requiring pilot holes or subsequent machining steps, thereby achieving both high precision and improved productivity in a single operation
Solution Approach 2:
The patent extracts and eliminates the intermediate pilot hole formation step from the conventional two-step process. By using laser beam irradiation directly on the surface, it forms ventilation holes without requiring pre-drilled pilot holes, thus simplifying the process and improving efficiency
2Productivity
If conventional drilling is used to form ventilation holes, then productivity is improved, but manufacturing precision deteriorates due to machining damage
Solution Approach 1:
The patent substitutes mechanical drilling with laser beam irradiation, which forms holes through controlled ablation rather than mechanical removal. This eliminates machining damage and produces smooth inner surfaces without requiring subsequent machining steps, thereby maintaining both productivity and precision
Solution Approach 2:
The patent changes the physical state and parameters of the laser beam (wavelength, pulse duration, energy density) to optimize the ablation process. By controlling these parameters, it achieves clean hole formation with minimal thermal damage and smooth inner surfaces, overcoming the limitations of conventional mechanical drilling
3Productivity
If laser beam irradiation is applied directly without surface roughening, then productivity is improved, but manufacturing precision deteriorates due to poor laser absorption
Solution Approach 1:
The patent applies surface roughening as a preliminary treatment before laser beam irradiation. This pre-processing step increases the surface area and improves laser beam absorption, enabling effective hole formation with better precision while maintaining the productivity benefits of direct laser processing
Solution Approach 2:
The patent creates localized surface roughness specifically at the areas where laser irradiation will be applied. This local modification of surface quality enhances laser absorption only where needed, improving hole formation precision without requiring extensive pre-processing of the entire workpiece
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of ventilation holes with smooth inner surfaces and minimal machining damage in a single step, significantly improving processing precision and productivity, particularly for challenging materials like silicon carbide, by enhancing laser absorption and reducing the need for additional etching processes.
Implementation Method 1
irradiating a laser beam having a wavelength within a range of 200 nm to 600 nm on a roughened surface of the electrode plate so as to form ventilation holes in the electrode plate which pass through the electrode plate in a thickness direction
Implementation Method 2
roughening a surface of an electrode plate for a plasma processing apparatus such that a center line average roughness Ra becomes in a range of 0.2 μm to 30 μm; and irradiating a laser beam having a wavelength within a range of 200 nm to 600 nm on a roughened surface
Data Source
AI summary
This method for forming ventilation holes in an electrode plate includes: a roughening step of roughening a surface of an electrode plate for a plasma processing apparatus such that a center line average roughness Ra becomes in a range of 0.2 μm to 30 μm; and a ventilation hole forming step of irradiating a laser beam having a wavelength within a range of 200 nm to 600 nm on a roughened surface of the electrode plate so as to form ventilation holes in the electrode plate which pass through the electrode plate in a thickness direction, wherein in the ventilation hole forming step, a focus spot of the laser light is swirled along a planar direction of the electrode plate so as to form a circular irradiation area, and while moving the irradiation area along a planar direction of the electrode plate in a circular movement, the focus spot of the laser light is shifted in a thickness direction of the electrode plate.