Laser-Welded Heat-Radiating Structure for Thin Electronic Assemblies
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Solution Overview
Problem
The challenge in electronic devices is the need for effective heat transfer from heat sources to other components while minimizing device thickness and preventing separation of heat-radiating members due to adhesive wear or damage.
Innovation Solution
A heat-radiating structure is coupled directly to a support member using laser welding, eliminating the need for adhesives and reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large-area heat-radiating fin is used to improve heat dissipation, then heat dissipation performance is improved, but wind resistance increases and aerodynamic performance deteriorates
Solution Approach 1:
The heat-radiating fin is divided into multiple segments along the airflow direction, with each segment having a smaller projected area. This segmentation reduces overall wind resistance while maintaining heat dissipation effectiveness through distributed radiation surfaces.
Solution Approach 2:
The fin structure transitions from a two-dimensional flat surface to a three-dimensional folded configuration. By folding the fin along the airflow direction, the projected area perpendicular to airflow is reduced while the total heat-radiating surface area is maintained or increased.
2Object-affected harmful factors
If the fin is folded to reduce wind resistance, then aerodynamic performance is improved, but manufacturing complexity increases
Solution Approach 1:
The fin is divided into multiple easily manufacturable segments that can be formed using standard stamping or molding processes. Each segment is simple in shape, but their coordinated folding arrangement achieves the complex aerodynamic function of reduced wind resistance.
3Object-affected harmful factors
If the fin area is reduced to lower wind resistance, then aerodynamic performance is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The fin is folded along the airflow direction to create a three-dimensional structure where the projected area (affecting wind resistance) is reduced while the actual surface area (affecting heat dissipation) is maintained. This dimensional transformation decouples the two competing requirements.
Solution Approach 2:
Multiple fin segments are arranged along the airflow direction, each contributing to heat dissipation while their folded configuration minimizes the cumulative projected area, thereby reducing wind resistance without sacrificing heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively dissipates heat and reduces the overall thickness of the electronic device by ensuring a secure and durable heat transfer path.
Implementation Method 1
a heat-radiating structure comprising a heat-radiating fin
Data Source
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AI summary
An electronic device according to various embodiments of the present disclosure comprises: a housing; a display arranged in the housing; a support member which supports the display, and which comprises a first surface facing the display, a second surface facing the opposite direction of the first surface, and a first opening penetrating at least one portion of the first surface and the second surface; a battery which is arranged on the second surface of the support member, and which has at least one portion facing the first opening; a printed circuit board arranged on the second surface of the support member and spaced from the battery; and a heat-radiating member configured to mediate heat transfer between the display and the printed circuit board, wherein the heat-radiating member comprises a first area having least one portion overlappingly arranged on the first surface, and a second area which is coupled to the first area and which has at least one portion arranged in the first opening, and the at least one portion of the first area can be coupled to the support member by means of laser welding. Other various embodiments are possible.