Lateral BJT ESD Protection via Collector Doping

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Solution Overview

Problem

Lateral bipolar junction transistors (BJTs) are not as effective as vertical BJTs in electrostatic discharge protection performance and increasing their size to improve this performance results in increased volume, making them unsuitable for compact applications.

Innovation Solution

The structure of a lateral BJT is modified by forming a high concentration doping area in the collector region and adding a second base area, which allows for improved electrostatic discharge protection without increasing the size by enhancing triggering voltage, sustain voltage, and maximum electrostatic discharge current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the size of a lateral BJT is increased to improve electrostatic discharge protection performance, then the electrostatic discharge protection performance is improved, but the volume of the transistor increases

Engineering Contradiction:
Improveelectrostatic discharge protection performanceVSAvoidtransistor volume
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent applies local quality by creating a high concentration doping area specifically in the collector region rather than uniformly increasing the entire transistor size. This localized modification of doping concentration in a specific region enhances the electrostatic discharge protection performance while maintaining a compact overall transistor structure, thus resolving the contradiction between improved reliability and reduced volume.

Inventive Principle:
Principle #3Local quality

2Speed

If the positions of emitter and base are switched to advance the triggering point, then the tunneling effect occurs faster, but satisfactory electrostatic discharge protection performance cannot be achieved alone

Engineering Contradiction:
Improvetunneling effect speedVSAvoidelectrostatic discharge protection performance
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent applies parameter changes by modifying the doping concentration parameter in the collector region through high concentration doping. This parameter modification enhances both the triggering speed and the electrostatic discharge protection performance simultaneously, resolving the contradiction where simply switching emitter and base positions could advance triggering but insufficiently improve overall protection performance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modified BJT structure effectively improves electrostatic discharge protection performance by adjusting triggering voltage, increasing sustain voltage, and enhancing maximum electrostatic discharge current, thereby protecting semiconductor devices without increasing the transistor's size.

Implementation Method 1

when the positions of the emitter 17 and the base 19 are switched, the tunneling effect of a BJT occurs faster, so that this may advance the triggering point

Methodology Applied
Scientific EffectTunneling effect:

Implementation Method 2

A first well 12 is formed by implanting a p-type impurity into the semiconductor substrate 11 at the lower side of the first device isolation layer 14, and a second well 13 is formed by implanting an n-type impurity into the semiconductor substrate 11 at the lower side of the third device isolation layer 16

Methodology Applied
Scientific EffectIon implantation: Ion Implantation

Data Source

PatentUS9299817B2Bipolar junction transistor and method of manufacturing the same
Publication Date: 2016.03.29 DONGBU HITEK CO LTD
  • US9299817B2 patent drawing
  • US9299817B2 patent drawing
  • US9299817B2 patent drawing

AI summary

A bipolar junction transistor (BJT) is provided. The BJT can include a semiconductor substrate, a first well disposed in the substrate and implanted with a first impurity, a second well disposed at one side of the first well and implanted with a second impurity, a first device isolation layer disposed in the first well and defining an emitter area, and a second device isolation layer disposed in the second well and defining a collector area, The BJT can also include an emitter having a second impurity, a base having a first impurity, a collector having a second impurity, and a high concentration doping area having a second impurity at high concentration. The high concentration doping area can be provided at one side of the collector in the second well.