Lateral Light Emitting Device with Vertical Reflection
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Solution Overview
Problem
Existing semiconductor laser devices have a large size due to the protrusion of the light reflecting layer, which increases the space between the semiconductor laser chip and the reflecting mirror, necessitating a reduction in device size while maintaining effective light emission and heat dissipation.
Innovation Solution
A light emitting device configuration featuring a base with insulating properties, a metal part of specific thickness, and a reflective member positioned to reflect light upward, with metal parts strategically placed to reduce size and enhance heat dissipation, allowing for efficient lateral light emission and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light reflecting layer protrudes toward the reflecting mirror, then the space between the semiconductor laser chip and the reflecting mirror is increased, but the size of the light emitting device is increased
Solution Approach 1:
The patent repositions the reflective member from a horizontal arrangement (requiring protrusion) to a vertical arrangement above the light emitting element. This dimensional change allows the reflective member to face the light emitting element without requiring lateral protrusion, thereby reducing device size while maintaining effective light reflection and emission efficiency.
Solution Approach 2:
Instead of having the light reflecting layer protrude toward the reflecting mirror in the conventional horizontal configuration, the patent inverts the arrangement by placing the reflective member vertically above the light emitting element. This inversion eliminates the need for protrusion and reduces the overall device footprint while achieving the same light reflection function.
2Reliability
If the space between the semiconductor laser chip and the reflecting mirror is increased, then light emission is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The metal part is designed to perform multiple functions simultaneously: it serves as a structural support for the light emitting element, provides thermal conduction for heat dissipation, and enables the vertical positioning of the reflective member. This multi-functionality resolves the contradiction by integrating heat dissipation and light emission functions into a single component system.
Solution Approach 2:
The metal part acts as an intermediary component between the light emitting element and the base, providing both mechanical support and thermal conduction pathways. This intermediary structure enables effective heat dissipation while maintaining the optimized spatial arrangement for light emission, resolving the contradiction between light emission efficiency and heat dissipation.
3Temperature
If additional heat dissipation members like submounts are added, then heat dissipation is improved, but device complexity and size are increased
Solution Approach 1:
The patent merges the support function and heat dissipation function into a single metal part, eliminating the need for separate submounts or heat dissipation members. This merging reduces device complexity and size while maintaining effective heat dissipation through the metal part's direct thermal conduction to the base.
Solution Approach 2:
The metal part is designed as a multi-functional component that simultaneously provides structural support, thermal conduction, and positioning for the reflective member. This universality eliminates the need for additional dedicated heat dissipation members, thereby reducing device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a reduction in the size of both light emitting devices and modules while maintaining effective light emission and heat dissipation, allowing for more compact and efficient designs without the need for additional heat dissipation members like submounts.
Implementation Method 1
a first reflective member that is disposed on the upper surface of the base without the first upper metal part being interposed between the first reflective member and the base, is disposed to face the first light emitting element, and has a first reflective surface configured to reflect the light upward
Data Source
AI summary
A light emitting device includes: an insulating base; a first upper metal part located on an upper surface of the base; a first light emitting element that is disposed on the upper surface of the base with the first upper metal part being interposed between the first light emitting element and the base, and is configured to emit light laterally from a first emission end surface of the first light emitting element; a first reflective member that is disposed on the upper surface of the base without the first upper metal part being interposed between the first reflective member and the base, faces the first light emitting element, and has a first reflective surface configured to reflect the light upward; and one or more lower metal parts located on the lower surface of the base.