Lateral-Extended MOSFET Structure for Subthreshold Hump Suppression

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Solution Overview

Problem

The subthreshold hump effect in MOSFETs, caused by shallow-trench isolation processes, leads to non-uniformities and parasitic transistors with lower threshold voltage, resulting in higher leakage currents and undesirable noise behavior in analog circuits.

Innovation Solution

A lateral-extended MOSFET design is implemented, featuring a substrate with an active region, a gate region extended over the active region, and a source region with subregions of varying widths, which introduces additional resistance between the source/drain and channel regions, reducing the impact of parasitic transistors and eliminating the subthreshold hump effect.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If shallow-trench isolation (STI) processes are used in MOSFET manufacturing, then device fabrication is enabled, but divots appear along the active region edge causing non-uniformities and parasitic transistors with lower threshold voltage

Engineering Contradiction:
ImproveMOSFET fabrication capabilityVSAvoidactive region edge uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

A lateral-extended source region is introduced as an intermediary structure between the STI edge and the channel. This extended source region with varying width serves as a mediator that increases resistance in the parasitic transistor path, thereby isolating the harmful effect of STI-induced divots from the main channel while maintaining fabrication feasibility

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The source region width is varied laterally to create different resistance zones. By changing the geometric parameter (width) of the source region, the resistance is increased in specific areas to suppress parasitic transistor conduction while maintaining the standard STI fabrication process

Inventive Principle:
Principle #35Parameter changes

2Productivity

If parasitic transistors are present due to STI edge non-uniformities, then additional current paths are created, but leakage current increases due to lower threshold voltage of parasitic transistors

Engineering Contradiction:
Improvetotal drain currentVSAvoidleakage current
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The source region width is modified to create high-resistance zones that selectively suppress parasitic transistor current while maintaining sufficient current for the main channel. This parameter change in source geometry allows differentiation between useful and parasitic current paths

Inventive Principle:
Principle #35Parameter changes

3Reliability

If parasitic transistors contribute to total drain current, then device operation is maintained, but noise behavior deteriorates in analog circuits

Engineering Contradiction:
Improvedevice operationVSAvoidnoise in analog circuits
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

Different regions of the source are given different widths to create local quality variations. The lateral-extended source region has non-uniform width that creates high resistance specifically in the parasitic transistor path while maintaining lower resistance in the main channel path, thereby locally suppressing noise without affecting overall device operation

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design reduces or eliminates the subthreshold hump effect, minimizing leakage currents and noise in analog circuits by increasing resistance in the parasitic transistor paths, thereby improving the overall performance of MOSFETs.

Implementation Method 1

introduces additional resistance between the source/drain and channel regions

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Data Source

PatentUS20250107135A1Lateral-extended transistor structures for minimizing subthreshold hump effect
Publication Date: 2025.03.27 CIRRUS LOGIC INT SEMICON LTD
  • US20250107135A1 patent drawing
  • US20250107135A1 patent drawing
  • US20250107135A1 patent drawing

AI summary

A semiconductor structure may include a substrate, an active region formed on the substrate, a gate region extended over the active region along a first direction parallel to a surface of the substrate, and a source region formed within the active region and adjacent to the gate region in a second direction parallel to the surface and perpendicular to the first direction. The source region may comprise a first subregion and a second subregion such that the second subregion is between the first subregion and the gate region. The first subregion may comprise a first width along the first direction and the second subregion may comprise a second width along the first direction. The first width may be less than the second width.