Lateral Optical Chip Mounting for Thin Backlight Units
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Solution Overview
Problem
Conventional back light units for LCDs have limited thickness reduction due to optical device chips being mounted supine on printed circuit boards, causing light to be emitted upwardly.
Innovation Solution
A method of manufacturing optical devices for back light units where optical device chips are mounted on printed circuit boards in a lateral position, involving steps such as preparing substrates with vertical insulating layers, forming cavities, depositing solder resist, and performing plating to enable lateral light emission, thereby reducing overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If optical device chips are mounted supine on printed circuit boards, then light is emitted upwardly, but the overall thickness of the back light unit increases
Solution Approach 1:
The patent inverts the conventional mounting orientation of optical device chips from supine (emitting light upward) to lateral (emitting light sideways). By rotating the chip 90 degrees and mounting it on its side, the light emission direction changes from vertical to lateral, allowing the back light unit to achieve reduced thickness while maintaining proper light emission functionality.
Solution Approach 2:
The patent changes the dimension of light emission from the vertical direction (upward) to the lateral direction (sideways). This dimensional change allows the optical device to emit light in a different orientation, enabling the back light unit to be thinner while still providing the necessary illumination function.
2Length of moving object
If optical device chips are mounted in lateral position, then light is emitted laterally and thickness is reduced, but the mounting process becomes more complex
Solution Approach 1:
The patent applies preliminary action by pre-forming cavities and grooves on the printed circuit board before mounting the optical device chips. These pre-prepared structures guide the lateral mounting process and ensure proper positioning, thereby reducing the complexity of the actual mounting operation despite the non-conventional orientation.
Solution Approach 2:
The patent introduces cavities and grooves as intermediary structures that facilitate the lateral mounting of optical device chips. These intermediary features serve as guides and support structures, making the complex lateral mounting process more manageable and precise.
3Manufacturing precision
If vertical insulating layers are exposed by partial cutting, then plating can be performed, but manufacturing steps increase
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: first forming cavities and grooves, then performing partial cutting to expose vertical insulating layers, and finally applying plating. This segmentation allows each step to be optimized independently, ensuring precise plating layer formation while managing the overall manufacturing cycle through systematic process organization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a significant reduction in the overall thickness of the back light unit by enabling light emission from optical device chips in a lateral direction, enhancing the thinness of flat panel displays.
Implementation Method 1
performing plating
Implementation Method 2
depositing a solder resist on the upper surface or a lower surface of the original substrate
Data Source
AI summary
The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit.Provided is a method of manufacturing an optical device for a back light unit, the method comprising: (a) preparing an original substrate having vertical insulating layers interposed therebetween; (b) partially cutting the original substrate to a predetermined depth from an upper surfaces thereof such that the cut portion is orthogonal at least to the vertical insulation layers, and exposing a region where a plating layer for soldering is to be formed; (c) performing plating; (d) mounting optical device chips on a plurality of chip substrate regions divided to include the vertical insulating layers; and (e) cutting each chip substrate region.