Lateral Transfer Apparatus for Substrate Handling
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Solution Overview
Problem
Conventional substrate handling systems in semiconductor processing are inadequate for efficiently transferring substrates within cluster tool environments, particularly as the number of processing chambers increases, leading to space inefficiencies and thermal non-uniformity issues.
Innovation Solution
The introduction of a transfer apparatus with lateral translation, rotational, and vertical movement capabilities, integrated with a carousel system that operates in concert with a central robot to access additional substrate positions without conventional wafer carriers, allowing for efficient substrate transfer and processing within a defined footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional wafer transfer systems are used in cluster tools with increasing number of processing chambers, then substrate processing capability is improved, but space efficiency deteriorates and thermal non-uniformity issues arise
Solution Approach 1:
The transfer apparatus introduces lateral translation capability in addition to rotational movement, enabling substrates to be accessed from multiple directions (laterally and radially). This dimensional expansion allows the system to serve more processing chambers within a compact footprint by utilizing three-dimensional space more effectively rather than expanding horizontally
2Adaptability or versatility
If conventional wafer transfer systems are used in cluster tools with increasing number of processing chambers, then substrate processing capability is improved, but thermal non-uniformity issues arise
Solution Approach 1:
The invention removes conventional wafer carriers from the transfer system, allowing substrates to be held and transferred directly by the end effector arms. This extraction eliminates the thermal mass and thermal gradients associated with large wafer carrier structures, reducing thermal non-uniformity while maintaining the ability to process multiple substrates across multiple chambers
3Productivity
If conventional wafer transfer systems are used, then substrate transfer is achieved, but particle contamination increases
Solution Approach 1:
By removing conventional wafer carriers from the system, the invention eliminates surfaces that can generate and shed particles during transfer operations. The direct end effector-to-substrate contact minimizes the introduction of contaminants while maintaining efficient transfer capability across the cluster tool
4Adaptability or versatility
If lateral translation capability is added to the transfer apparatus, then access to additional substrate positions is improved, but device complexity increases
Solution Approach 1:
The invention integrates lateral translation and rotational movement capabilities into a single transfer apparatus structure, where the end effector is coupled to both lateral translation and rotation mechanisms. This merging of functions allows the system to access multiple substrate positions (both laterally and radially) while avoiding the complexity of separate independent transfer systems
Data Source
AI summary
Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.