Lateral Wireless Communication Pads for Semiconductor Package Size Reduction
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Solution Overview
Problem
Current packaging architectures for semiconductor devices are limited by vertical connectivity, which increases the overall dimensions of packages and does not efficiently utilize lateral space for increased functionality without adding complexity or cost.
Innovation Solution
Implementing packaged semiconductor devices with communication pads on side surfaces for lateral wireless signal exchange, using established lead-frame structures and metallization techniques to enable flexible and efficient communication without increasing package size or complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertical connectivity is used to connect semiconductor devices, then electrical connection between devices is achieved, but the overall dimensions of packages increase
Solution Approach 1:
The patent transitions from vertical connectivity (z-direction) to lateral connectivity (x-y plane) by positioning communication pads on the side surfaces of packages. This dimensional shift allows devices to communicate horizontally without increasing vertical stack height, resolving the contradiction between achieving reliable connection and minimizing package dimensions.
2Reliability
If lateral wireless communication is implemented, then connectivity is enhanced without increasing package size, but additional communication pads and routing are required
Solution Approach 1:
The communication pads on side surfaces serve multiple functions: they enable wireless communication between laterally adjacent devices, provide RF signal transmission, and can be integrated with existing package substrates. This multi-functionality approach enhances connectivity without proportionally increasing complexity, as the same pad structure supports various communication protocols and configurations.
Solution Approach 2:
The patent combines wireless communication functionality with the existing package substrate structure. The communication pads are integrated into the package substrate rather than being separate components, and the RF circuitry is merged with the device architecture. This consolidation reduces overall complexity by eliminating discrete communication modules and interconnectors.
3Quantity of substance
If three-dimensional chip systems with stacked configuration are used, then volumetric packing density is increased, but routing complexity in the package increases
Solution Approach 1:
The patent introduces lateral communication paths (x-y plane) to complement vertical stacking (z-direction). By enabling devices at the same stack level to communicate horizontally through side-surface pads, the need for complex vertical routing through multiple stack levels is reduced. This dimensional addition simplifies the routing architecture while maintaining high volumetric density.
Data Source
AI summary
A packaged semiconductor device includes an insulating material forming a side surface of the packaged semiconductor device. An integrated-circuit chip is embedded in the insulating material and includes a communication circuit. A wiring system is embedded in the insulating material and electrically couples the integrated-circuit chip with a plurality of package contact elements. A first communication pad is formed in the side surface and is operatively coupled to the communication circuit to enable signal exchange through the first communication pad.