Lattice Element in Semiconductor Package Warpage
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Solution Overview
Problem
Semiconductor packages face warpage issues due to coefficient of thermal expansion mismatches between the substrate and molding element, leading to uneven substrates and potential process failures as packages become thinner.
Innovation Solution
Incorporating a lattice element with a rigid open framework inside the molding element, featuring a body with openings and supports that are stronger than the molding element, to absorb and resist thermal stresses, thereby reducing warpage and enhancing mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the package thickness is reduced to meet size requirements, then the size and weight are reduced, but warpage increases due to thermal expansion mismatches
Solution Approach 1:
The substrate is divided into a solid portion and a lattice portion with open framework structure. The lattice portion segments the substrate material to reduce overall density and thermal mass, allowing better thermal expansion management while maintaining mechanical support functionality.
Solution Approach 2:
The lattice portion uses an open framework structure with voids spaces, creating a porous material that reduces the substrate's thermal mass and allows more uniform thermal expansion. This porous structure helps maintain substrate flatness even when package thickness is reduced.
2Stability of the object's composition
If a lattice element with open framework is added to reduce warpage, then substrate flatness is improved, but device complexity increases
Solution Approach 1:
The lattice element is merged with the substrate to form an integrated structure. The substrate includes both solid and lattice portions that work together as a unified component, reducing the need for separate warpage compensation structures and simplifying the overall device assembly.
Solution Approach 2:
The lattice portion serves multiple functions: it provides mechanical support, manages thermal expansion, and maintains substrate flatness. This multi-functionality reduces the need for additional specialized components, thereby managing device complexity despite the innovative structure.
3Weight of stationary object
If the package is made thinner to reduce weight, then weight is reduced, but mechanical strength decreases
Solution Approach 1:
The substrate is constructed as a composite material system combining solid portions and lattice portions with different structural properties. This composite structure optimizes the strength-to-weight ratio by placing material strategically where needed while maintaining overall package integrity.
Solution Approach 2:
The packaging structure is segmented into multiple functional elements including the lattice element with openings, solid substrate portions, and voids spaces. This segmentation allows each component to be optimized for its specific function while contributing to overall mechanical strength despite reduced weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The lattice element effectively suppresses warpage and electromagnetic interference, improving the reliability and mechanical strength of semiconductor packages while maintaining thinness.
Implementation Method 1
coefficient of thermal expansion mismatches between the substrate and molding element, leading to uneven substrates and potential process failures
Data Source
AI summary
Provided is a semiconductor package including a substrate; at least one semiconductor chip mounted on the substrate; a molding element, which is arranged on the substrate and encapsulates the at least one semiconductor chip; and a lattice element, which is arranged inside the molding element, where the lattice element includes a body having a plurality of openings.