Lattice Frame Light-Emitting Device Manufacturing
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Solution Overview
Problem
Conventional methods for manufacturing light-emitting devices using lead frames hinder high-density mounting of light-emitting elements and require large-scale facilities, making cost reduction and desired light distribution characteristics unattainable.
Innovation Solution
A method involving a plate-shaped substrate with a lattice frame, where light-emitting elements are mounted and sealed with a resin within the lattice frame, allowing for high-density mounting and elimination of the need for large-scale facilities by dispensing and curing the resin without a mold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a lead frame with mold is used for sealing light-emitting elements, then the sealing process can be completed, but the facility size becomes large and manufacturing cost increases
Solution Approach 1:
The patent extracts the sealing function from the traditional mold-based process. Instead of using a large-scale mold facility, the invention applies sealing resin directly to the lead frame using a dispenser, separating the sealing function from the molding facility and enabling compact manufacturing equipment.
Solution Approach 2:
The lead frame structure itself serves as the sealing cavity boundary. The recessed portions and protrusions on the lead frame automatically define the sealing space, eliminating the need for external mold walls and enabling the system to seal itself without large-scale molding facilities.
2Ease of manufacture
If a lead frame with mold is used for sealing light-emitting elements, then the sealing process can be completed, but manufacturing cost increases
Solution Approach 1:
The patent removes the expensive mold facility from the sealing process. By using direct resin application with a dispenser on the lead frame, the invention eliminates capital equipment costs and reduces manufacturing overhead, making the process more cost-effective.
Solution Approach 2:
The invention replaces expensive, reusable mold facilities with a simpler, disposable-like approach where the lead frame itself serves as the sealing structure. This eliminates the need for costly mold maintenance and replacement while achieving the same sealing function.
3Ease of manufacture
If conventional lead frame method is used, then light-emitting elements can be mounted, but high-density mounting cannot be achieved
Solution Approach 1:
The lead frame is divided into multiple recessed portions that can accommodate multiple light-emitting elements in close proximity. This segmented structure enables high-density mounting by providing individualized sealing spaces for each element while maintaining compact overall dimensions.
Solution Approach 2:
The invention utilizes the vertical dimension by creating recessed portions that extend downward from the lead frame surface. This three-dimensional approach allows elements to be mounted closely in the horizontal plane while maintaining separation through vertical depth, achieving high density without compromising individual element isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-density mounting of light-emitting elements, reduces manufacturing costs, and achieves desired light distribution characteristics by using a lattice frame to seal and reflect light without requiring a large-scale facility.
Implementation Method 1
The forming of the lattice frame is conducted such that an uncured resin is applied on the light-emitting element mounting surface by a dispenser and then cured.
Implementation Method 2
a reflector is not formed and it is not possible to obtain a light-emitting device having desired light distribution characteristics
Data Source
AI summary
A method of manufacturing a light-emitting device includes providing a plate-shaped substrate, forming a lattice frame on a light-emitting element mounting surface of the plate-shaped substrate, mounting a light-emitting device in an opening of the lattice frame on the light-emitting element mounting surface, sealing the light-emitting element by supplying a sealing material into the opening of the lattice frame, and cutting the lattice frame and the plate-shaped substrate so as to split the lattice flame to obtain a plurality of light-emitting devices with a sidewall.