Layer Stack Adhesion via Intermediate Composition Matching

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Solution Overview

Problem

In semiconductor device production, adhesion problems arise at the interfaces between different materials, leading to unreliable bonding, which is challenging to address effectively.

Innovation Solution

A method involving forming a first layer on a substrate, followed by intermediate processing, and then creating an additional layer with a similar material composition to the first layer, which reduces or eliminates negative influences on adhesion properties, allowing for reliable adhesion between layers by applying a second layer directly onto the additional layer without further surface modification.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If intermediate processing is performed on the first layer, then the manufacturing process can proceed with necessary treatments, but the adhesion properties of the first layer are degraded

Engineering Contradiction:

Improvemanufacturing process progressionVSAvoidadhesion properties

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

A second layer is introduced as an intermediary between the first layer and the third layer. The second layer has similar material composition to the first layer (differing by at most 10% by weight), which allows it to bridge the adhesion gap caused by intermediate processing. This intermediary layer compensates for the degraded adhesion properties of the first layer while enabling the manufacturing process to continue.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The material composition of the second layer is carefully controlled to differ from the first layer by at most 10% by weight. This parameter adjustment allows the second layer to maintain compatibility with the first layer for adhesion purposes, while still being distinct enough to serve its protective function. The composition parameter is optimized to balance adhesion requirements with functional requirements.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If different materials are stacked on top of each other, then functional requirements can be met, but adhesion problems arise at the interfaces

Engineering Contradiction:

Improvefunctional requirements fulfillmentVSAvoidadhesion at interfaces

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The second layer is designed with material composition similar to the first layer (differing by at most 10% by weight), creating a homogeneous transition zone. This homogeneity in material composition ensures strong adhesion between the first and second layers, while the second layer still provides the necessary functional differentiation when compared to the third layer. The principle of homogeneity is applied locally at the critical interface while maintaining overall functional versatility.

Inventive Principle:

Principle #33Homogeneity

Solution Approach 2:

The second layer serves as a mediator between materially different layers. By having composition similar to the first layer but serving a different functional role, it enables the stacking of different materials while maintaining adhesion. The intermediary layer allows functional versatility through material differentiation while ensuring reliability through compositional similarity at each interface.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If the surface of the additional layer is modified after formation, then further processing can be done, but the adhesion properties to the second layer are compromised

Engineering Contradiction:

Improveprocessing flexibilityVSAvoidadhesion to second layer

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The second layer is formed with the appropriate material composition and surface properties in advance, before any subsequent processing of the first layer. This preliminary formation ensures that the adhesion interface is established under optimal conditions. The second layer is prepared beforehand to have the correct composition (within 10% by weight of the first layer) and surface characteristics that ensure strong adhesion, and this state is maintained despite subsequent processing of underlying layers.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS11508878B2Method of producing a layer stack and layer stack

Publication Date: 2022.11.22 OSRAM OLED

AI summary

A method of producing a layer stack includes a) forming a first layer having a first material composition on a substrate, b) performing intermediate processing of the substrate with the first layer, c) forming an additional layer having a second material composition, the first material composition and the second material composition differing from each other by at most 10% by weight, at least locally directly on the first layer and d) applying a second layer at least in places directly onto the additional layer.