Layered Crystal Oscillator Core for Uniform Oven Temperature Control
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Solution Overview
Problem
In oven-controlled crystal oscillators, temperature differences between the piezoelectric resonator, oscillation IC, and heater IC can lead to unstable oscillation frequencies due to their separate disposition, affecting temperature adjustment accuracy.
Innovation Solution
A core section with a layered structure comprising an oscillation IC, piezoelectric resonator, and heater IC, closely positioned and thermally insulated, with thermal conductivity enhancers connecting facing surfaces for efficient heat transfer and stress protection, and a sandwich-structured piezoelectric resonator for reduced size and heat capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the piezoelectric resonator, oscillation IC, and heater IC are disposed separated from each other, then the device complexity is reduced and ease of manufacture is improved, but temperature uniformity deteriorates and oscillation frequency stability worsens
Solution Approach 1:
The patent merges the piezoelectric resonator, oscillation IC, and heater IC into a closely integrated configuration where they are disposed close to each other. This merging reduces thermal resistance and improves temperature uniformity across the components while maintaining manufacturing feasibility through standardized assembly processes.
Solution Approach 2:
The patent introduces a thermal conductivity enhancer as an intermediary substance between the components and the substrate. This mediator improves heat transfer efficiency and temperature distribution without complicating the manufacturing process, as it can be applied through standard coating or embedding techniques.
2Stability of the object's composition
If the piezoelectric resonator, oscillation IC, and heater IC are disposed close to each other, then temperature uniformity is improved and oscillation frequency stability is enhanced, but device complexity increases and manufacturing difficulty worsens
Solution Approach 1:
The patent changes the thermal conductivity parameter by introducing thermal conductivity enhancers between components and substrate. This parameter change improves temperature uniformity without requiring complex mechanical structures, as it involves material selection rather than structural complexity.
Solution Approach 2:
The patent addresses the proximity requirement by optimizing the vertical stacking arrangement and lateral positioning of components. By carefully controlling the spatial dimensions and using thin-film thermal interfaces, the patent achieves close thermal coupling without excessive structural complexity.
3Measurement precision
If thermal conductivity enhancers are used to connect facing surfaces, then heat transfer efficiency is improved and temperature control accuracy is enhanced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The thermal conductivity enhancer serves multiple functions simultaneously: it enhances heat transfer, provides mechanical bonding between components, and fills gaps in the assembly. This self-service approach improves temperature control accuracy without requiring separate bonding and thermal interface steps, thereby limiting the increase in device complexity.
4Reliability
If the core section is fixed to the package via the core substrate, then stress protection is improved and reliability is enhanced, but thermal conductivity may be reduced
Solution Approach 1:
The patent uses composite material structures for the core substrate and thermal conductivity enhancers that combine mechanical strength with thermal conductive properties. This composite approach maintains stress protection and reliability while minimizing thermal resistance at the bonding interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes oscillation frequency by ensuring precise temperature control, reducing noise and power consumption, while preventing thermal convection and improving temperature followability and stability.
Implementation Method 1
a thermal conductivity enhancer fixes at least one pair of facing surfaces to each other out of the following pairs: respective facing surfaces of the oscillation IC and the piezoelectric resonator; respective facing surfaces of the piezoelectric resonator and the heater IC; and respective facing surfaces of the heater IC and the core substrate
Implementation Method 2
a heater IC... The temperature of the core section is controlled... by the heater IC
Implementation Method 3
In a piezoelectric resonator such as a crystal resonator, the vibration frequency changes depending on the temperature... an oven-controlled crystal (Xtal) oscillator... includes a piezoelectric resonator
Data Source
AI summary
An oven-controlled crystal oscillator according to one or more embodiments may include a core section hermetically encapsulated in a package for thermal insulation, wherein the core section is supported by the package via a core substrate, and the core section has a layered structure in which at least an oscillation IC, a crystal resonator and a heater IC are laminated in sequence.