Layered Display Structure for Large High-Definition Panels
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Solution Overview
Problem
Current display apparatuses with divided display regions are limited by the size of silicon wafers, making it difficult to manufacture large, high-definition displays with diagonal sizes exceeding 20 inches due to the constraints of semiconductor substrate sizes.
Innovation Solution
A display apparatus design featuring a layered structure with a substrate and circuit regions including low-temperature polysilicon transistors and metal oxide transistors, allowing for overlapping circuit and display regions, and using glass substrates to enable larger diagonal sizes beyond conventional silicon wafer limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a silicon wafer is used for a semiconductor substrate, then the manufacturing precision and reliability are improved, but the diagonal size of the display apparatus is limited to approximately 20 inches
Solution Approach 1:
The display apparatus is divided into multiple display regions (first display region and second display region) that can be manufactured separately on smaller substrates and then integrated, bypassing the silicon wafer size limitation while maintaining high manufacturing precision for each segment
Solution Approach 2:
Multiple display regions manufactured on separate substrates are combined into a single integrated display apparatus, achieving a large diagonal size exceeding 20 inches while preserving the high manufacturing precision of individual regions through the overlapping structure
2Area of stationary object
If the bezel region is reduced to increase the display area, then the area of the display portion is improved, but the space for providing driver circuits is reduced
Solution Approach 1:
The driver circuits are positioned in the overlapping region between the first and second display regions, utilizing the vertical stacking dimension rather than horizontal bezel space, thereby maximizing the display area while providing adequate space for driver circuit integration
Solution Approach 2:
The driver circuits are nested within the overlapping region of the stacked display structures, allowing compact integration of control functionality within the display apparatus footprint without increasing the overall bezel size
Data Source
AI summary
A high-definition display apparatus with a large diagonal size is provided. The display apparatus includes a first layer and a second layer positioned above the first layer. The first layer includes a substrate and a plurality of circuit regions, and the second layer includes a plurality of display regions. The substrate is a glass substrate. Each of the plurality of circuit regions includes a driver circuit, and the driver circuit includes a transistor including low-temperature polysilicon in a channel formation region. Each of the plurality of display regions includes a display pixel, and the display pixel includes a light-emitting device and a transistor including a metal oxide in a channel formation region. The driver circuit included in one of the plurality of circuit regions has a function of driving the display pixel included in one of the plurality of display region.