Layered Module Cover for Display Device Rigidity

The patent applies composite materials by combining multiple layers with different properties: a first layer (e.g., aluminum alloy) providing lightweight strength, a second layer (e.g., stainless steel) providing high rigidity and heat resistance, and a third layer (e.g., magnesium alloy) providing additional strength. This composite structure achieves superior rigidity and protection stability while maintaining manufacturing feasibility through standardized assembly processes.

The rigid structure is segmented into multiple functional layers, each serving a specific purpose: the first layer provides lightweight structural support, the second layer provides thermal stability and rigidity, and the third layer provides additional mechanical strength. This segmentation allows each layer to be optimized independently while simplifying the overall manufacturing process through modular assembly.

The patent uses composite materials with different density and strength characteristics to achieve optimal weight-strength ratio. The first layer (aluminum alloy) and third layer (magnesium alloy) provide lightweight structural support, while the second layer (stainless steel) provides necessary rigidity and heat resistance. This combination achieves high protection stability with minimal weight compared to using a single thick material.

Different regions of the rigid structure have different material compositions tailored to their specific functional requirements. Areas requiring high rigidity use stainless steel, while areas requiring lightweight support use aluminum or magnesium alloys. This local quality optimization ensures maximum protection stability with minimum overall weight.

The patent strategically selects materials with specific heat expansion coefficients for each layer: the first layer has a higher heat expansion coefficient than the second layer, while the third layer has a coefficient between the first and second layers. This parameter optimization allows the structure to accommodate thermal expansion differences without requiring extremely tight manufacturing tolerances, as the layered configuration naturally absorbs thermal stress.

The composite material structure inherently manages thermal expansion differences through the varying coefficients of each layer. The stainless steel middle layer acts as a thermal expansion buffer between the aluminum and magnesium alloy outer layers, reducing the overall manufacturing precision requirements while maintaining excellent thermal stability and structural integrity.

The rigid structure is divided into three distinct layers that can be manufactured separately using standardized processes and then assembled together. Each layer is optimized for its specific function, allowing independent manufacturing and quality control. This segmentation simplifies the overall manufacturing process compared to creating a single complex multi-material component, while achieving reduced weight and thickness.

The patent uses composite materials that can be manufactured using established industrial processes for each layer, with standardized interfaces and assembly methods. The modular composite structure allows for efficient manufacturing and assembly, reducing the complexity burden despite the multi-layer configuration. The standardized material interfaces and assembly procedures make the manufacturing process more manageable and cost-effective.