Display Substrate Layered Wiring for Under-Display Camera Pixels
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Solution Overview
Problem
In electronic devices like mobile phones and tablets, the integration of front cameras and infrared sensing elements requires transparent display areas, but the structural complexity and low pixel density of these areas lead to reduced transparency and imaging quality due to the limited number of wiring connections for pixel circuits.
Innovation Solution
A display substrate with a first display area of higher light transmittance and a second area with pixel circuits, where sub-pixel electrodes are connected through different layers, increasing the number of connecting portions and pixel density, thus improving display quality and reducing diffraction effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pixel circuits are arranged in the first display area to increase pixel density, then display resolution is improved, but light transmittance decreases and imaging quality of under-display cameras deteriorates
Solution Approach 1:
The display area is segmented into a first display area (with pixel circuits for high pixel density) and a second display area (without pixel circuits for high light transmittance). This spatial segmentation allows each region to optimize for its specific function, resolving the contradiction between pixel density and light transmittance.
Solution Approach 2:
Different regions of the display are assigned different structural qualities: the first display area has pixel circuits integrated for high resolution, while the second display area has a simplified structure for maximum light transmittance. This local differentiation allows simultaneous optimization of both pixel density and light transmittance in different areas.
2Manufacturing precision
If multiple connecting portions are arranged on the same layer to increase pixel density, then manufacturing is simplified, but the number of connecting portions is limited and pixel density cannot be sufficiently increased
Solution Approach 1:
The patent transitions from arranging connecting portions only on the same layer (2D arrangement) to utilizing multiple layers (3D arrangement). By stacking connecting portions across different layers, the number of connecting portions increases significantly without complicating the manufacturing process, as each layer can be formed using standard thin-film deposition techniques.
3Manufacturing precision
If the second display area is designed with lower light transmittance to accommodate pixel circuits, then pixel density is improved, but imaging quality of under-display cameras deteriorates due to increased diffraction effects
Solution Approach 1:
The display is segmented into regions with different optical properties. The second display area is specifically designed without pixel circuits to maintain high light transmittance and minimize diffraction effects, while the first display area accepts the trade-off for higher pixel density. This segmentation allows the camera area to optimize for optical performance.
Solution Approach 2:
The optical quality of different display regions is locally optimized: the second display area has high light transmittance and simple structure to minimize diffraction for camera imaging, while the first display area has complex pixel circuit structure for high pixel density. Each region's quality is tailored to its specific function.
Data Source
AI summary
A display substrate and a display device. The display substrate includes a first display area and a second display area. A light transmittance of the second display area is lower than a light transmittance of the first display area. Among the sub-pixel groups of each pixel unit in the first display area, first electrodes of sub-pixels of sub-pixel groups of the pixel unit are electrically connected to corresponding pixel circuits through first connecting portions, and first electrodes of sub-pixels of the other sub-pixel groups of the pixel unit are electrically connected to corresponding pixel circuits through second connecting portions, the first connecting portions and the second connecting portions are disposed in different layers, and the second connecting portion and a plurality of first electrodes of a plurality of sub-pixels of the sub-pixel groups of the pixel unit are disposed in different layers.