Layered Workpiece Thinning with Hybrid Thickness Measurement

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Solution Overview

Problem

Existing processing apparatuses struggle to uniformly thin down workpieces with multiple layered regions, as non-contact thickness measuring instruments fail to accurately measure the total thickness when light or ultrasonic waves are not well transmitted through certain regions, leading to potential air bubble trapping and non-uniform processing.

Innovation Solution

A method involving contact-based thickness measurement of specific regions, followed by adjusting the positional relation between the processing tool and holding table using the total thickness acquired from both contact and non-contact measurements, ensuring uniform thinning of the workpiece.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If non-contact thickness measuring instruments are used to measure workpiece thickness, then the workpiece is prevented from being damaged, but the measurement fails when light or ultrasonic waves are not well transmitted through certain regions

Engineering Contradiction:
Improveworkpiece integrityVSAvoidthickness measurement accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent segments the thickness measurement process into two distinct parts: (1) non-contact measurement for regions where light/ultrasonic waves transmit well, and (2) contact measurement for regions where waves do not transmit well. This segmentation allows each measurement method to be applied where it is most effective, resolving the contradiction between non-contact measurement benefits and measurement accuracy.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a contact-based thickness measurement method as an intermediary solution for regions where non-contact measurement fails. By using contact measurement as a supplement in specific regions, the system overcomes the limitation of wave transmission issues while maintaining the primary advantage of non-contact measurement for suitable regions.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If the entire workpiece is not finished uniformly to the predetermined thickness, then air bubbles are trapped between affixed surfaces of workpieces

Engineering Contradiction:
Improvethickness uniformityVSAvoidair bubble formation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent implements a feedback mechanism where thickness measurements (both contact and non-contact) are used to adjust the positional relation between the processing tool and holding table. This feedback loop ensures that the workpiece is processed to uniform thickness, preventing air bubble formation during subsequent affixing operations.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent performs preliminary thickness measurements and positional adjustments before the final processing step. By measuring thickness distribution and adjusting the tool-position relationship in advance, the system ensures uniform thickness is achieved before affixing, preventing air bubble entrapment.

Inventive Principle:
Principle #10Preliminary action

3Measurement precision

If contact-based thickness measurement is performed, then accurate thickness data is obtained, but the processing apparatus complexity increases

Engineering Contradiction:
Improvethickness measurement accuracyVSAvoidmeasurement system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies contact-based measurement only locally in regions where non-contact measurement is insufficient, rather than using contact measurement for the entire workpiece. This localized approach maintains measurement accuracy where needed while minimizing the increase in system complexity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent merges contact-based and non-contact-based measurement methods into a unified measurement system. By combining the advantages of both methods and using them complementarily, the system achieves accurate thickness measurement across all regions without requiring a completely complex redesign of the measurement apparatus.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise and uniform thinning of workpieces with layered structures by accurately measuring and adjusting the positional relation between the processing tool and holding table, preventing air bubble formation and achieving consistent thickness across the workpiece.

Implementation Method 1

a non-contact thickness measuring instrument for measuring a thickness of a workpiece by applying light or ultrasonic waves to the workpiece

Methodology Applied
Scientific EffectLight transmission: Light

Implementation Method 2

a non-contact thickness measuring instrument for measuring a thickness of a workpiece by applying light or ultrasonic waves to the workpiece

Methodology Applied
Scientific EffectUltrasonic wave transmission: Ultrasound

Implementation Method 3

by having its reverse side ground and polished

Methodology Applied
Scientific EffectAbrasion: Abrasion

Data Source

PatentUS20260027670A1Method of processing workpiece
Publication Date: 2026.01.29 DISCO CORP
  • US20260027670A1 patent drawing
  • US20260027670A1 patent drawing
  • US20260027670A1 patent drawing

AI summary

A method of thinning down a workpiece having a first region and a second region that are layered together includes acquiring a thickness of the first region, thinning down the second region by bringing a processing tool into contact with the workpiece held on a holding table, measuring a thickness of the second region of the workpiece that has been thinned down, adjusting a positional relation between the processing tool and the holding table by referring to a total thickness of the workpiece that includes the thickness of the first region and the thickness of the second region, and thinning down the workpiece by bringing the processing tool into contact with the workpiece held on the holding table.