LC Component Structure Using Post Conductors to Preserve Inductor Q
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Solution Overview
Problem
Existing LC composite electronic components experience degradation in Q value when mounted on a circuit board due to proximity of conductor patterns and inductor elements, leading to potential cracks and reduced performance.
Innovation Solution
The design includes post conductors with a height greater than the substrate thickness, maintaining a sufficient distance between the inductor element and circuit board conductor patterns, and incorporating insulating resin layers to enhance mechanical strength and stress relief.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the LC composite electronic component is mounted up-side down on a circuit board with the substrate positioned on the upper side, then the mounting flexibility is improved, but the Q value of the inductor element degrades due to proximity of conductor patterns on the circuit board
Solution Approach 1:
The patent introduces a vertical dimension by extending the inductor element upward from the substrate surface using a support structure. This dimensional change increases the vertical distance between the inductor element and the circuit board conductor patterns, thereby reducing electromagnetic interference and maintaining high Q value while preserving the upside-down mounting configuration.
2Device complexity
If the inductor element is positioned close to conductor patterns on the circuit board, then the device complexity is reduced, but the Q value degrades due to electromagnetic interference
Solution Approach 1:
The patent introduces an intermediary support structure that physically separates the inductor element from the circuit board. This support structure acts as a mediator that maintains the required distance between the inductor element and conductor patterns, reducing electromagnetic interference while keeping the overall device structure relatively simple.
3Strength
If the substrate thickness is increased to provide mechanical strength, then the structural stability is improved, but the distance between the inductor element and circuit board conductor patterns is reduced, causing Q value degradation
Solution Approach 1:
Instead of increasing substrate thickness horizontally, the patent extends the inductor element vertically upward from the substrate surface. This vertical extension in another dimension achieves the dual benefit of maintaining mechanical strength through adequate substrate thickness while simultaneously increasing the distance to circuit board conductor patterns to preserve Q value.
Data Source
AI summary
Disclosed herein is an electronic component that includes: a substrate; a capacitor on the substrate; a first insulating resin layer embedding therein the capacitor; an inductor provided on the first insulating resin layer and connected to the capacitor, the inductor including a conductor pattern; a second insulating resin layer embedding therein the inductor; a third insulating resin layer on the second insulating resin layer; a post conductor having a lower end and an upper end and penetrating the third insulating resin layer such that the lower end of the post conductor is connected to the inductor; and a terminal electrode on the third insulating resin layer and connected to the upper end of the post conductor. In a thickness direction of the substrate, the height of the post conductor is larger than a thickness of a conductor pattern constituting the inductor.